Invention Grant
- Patent Title: Method and system for extracting heat from electrical components
- Patent Title (中): 从电气部件提取热量的方法和系统
-
Application No.: US11608384Application Date: 2006-12-08
-
Publication No.: US07679916B2Publication Date: 2010-03-16
- Inventor: Chris Erwin Orr , David S. Slaton
- Applicant: Chris Erwin Orr , David S. Slaton
- Applicant Address: US VA Charlottesville
- Assignee: GE Intelligent Platforms Embedded Systems, Inc.
- Current Assignee: GE Intelligent Platforms Embedded Systems, Inc.
- Current Assignee Address: US VA Charlottesville
- Agency: GE Global Patent Operations
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.
Public/Granted literature
- US20080137307A1 METHOD AND SYSTEM FOR EXTRACTING HEAT FROM ELECTRICAL COMPONENTS Public/Granted day:2008-06-12
Information query
