公开(公告)号：US08662155B2

公开(公告)日：2014-03-04

申请号：US12682302

申请日：2008-10-10

Applicant: Klaus Weinmann ,  Philipp Hortmann

Inventor： Klaus Weinmann ,  Philipp Hortmann

IPC: F28F7/00

CPC classification number: H01L23/4338 ,  H01L23/4006 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention relates to a cooling device improving the heat transfer between a chip (2) having a semiconducting substrate (3) and a heat sink (7). The gap between a surface (11) of the chip (2) to be cooled and a surface (12) of the heat sink (7), the width of which depends on production tolerances of the elements and soldered connections, is formed as a wedge shape by an angled lower surface (12) of the heat sink, in order to create a wedge-shaped gap. A wedge element (17) having the same wedge angle as the wedge-shaped gap is inserted into said gap exactly far enough that it makes flat contact with both the chip surface (11) to be cooled and the heat sink surface (12). Dimensional deviations are thus compensated for, the use of gap fillers is avoided, and the heat transfer from the heat source to the heat sink is improved.

Abstract translation: 本发明涉及一种改善具有半导体衬底（3）的芯片（2）和散热器（7）之间的传热的冷却装置。 要冷却的芯片（2）的表面（11）与散热器（7）的表面（12）之间的间隙（其宽度取决于元件和焊接连接的生产公差）形成为 通过散热器的成角度的下表面（12）形成楔形，以便产生楔形间隙。 具有与楔形间隙相同的楔角的楔形元件（17）被精确地插入所述间隙，使其与要冷却的芯片表面（11）和散热片表面（12）平坦接触。 因此补偿尺寸偏差，避免使用间隙填料，并且改善从热源到散热器的热传递。

公开(公告)号：US08286009B2

公开(公告)日：2012-10-09

申请号：US12551116

申请日：2009-08-31

Applicant: David S. Slaton

Inventor： David S. Slaton

IPC: G06F1/00

CPC classification number: G06F1/26

Abstract: A method is provided for assembling a computer that includes a carrier board having a board management controller (BMC), a power supply, and a carrier bus. The method includes coupling a module to the carrier board, determining, by the carrier board, a type of the module, and providing power to the module based on the module type such that a voltage component of the power is one of a first voltage and a second voltage that is different than the first voltage.

Abstract translation: 提供一种用于组装包括具有板管理控制器（BMC），电源和载波总线的载板的计算机的方法。 该方法包括将模块耦合到载板，由载板确定模块的类型，并且基于模块类型向模块提供功率，使得功率的电压分量是第一电压和 与第一电压不同的第二电压。

公开(公告)号：US08270172B2

公开(公告)日：2012-09-18

申请号：US12766608

申请日：2010-04-23

Applicant: Bernd Sporer ,  Robert Ireland

Inventor： Bernd Sporer ,  Robert Ireland

IPC: H05K7/20

CPC classification number: H05K7/20545 ,  H05K7/1404 ,  Y10T29/49124

Abstract: A wedge lock for use with a single board computer includes a cooling plate positioned with respect to a printed circuit board (PCB), a clamp device configured to secure the single board computer in an operating environment, and a heat conductance plate positioned along a top surface of the cooling plate and a top surface of the clamp device to facilitate conduction cooling of the PCB.

Abstract translation: 与单板计算机一起使用的楔形锁包括相对于印刷电路板（PCB）定位的冷却板，构造成将单板计算机固定在操作环境中的夹紧装置，以及沿顶部定位的导热板 冷却板的表面和夹紧装置的顶表面，以便于PCB的传导冷却。

公开(公告)号：US08300424B2

公开(公告)日：2012-10-30

申请号：US12277430

申请日：2008-11-25

Applicant: Jerry Wright ,  David L. McDonald

Inventor： Jerry Wright ,  David L. McDonald

IPC: H05K7/14

CPC classification number: G06F1/185 ,  Y10T29/4913

Abstract: A mounting bracket for securing a mezzanine card in a stacked single board computer includes a main body that includes a first end, an opposite second end, a first side surface, and an opposite second side surface. The main body is sized to be positioned along a side surface of the mezzanine card, wherein the first side surface or the second side surface contacts the side surface of the mezzanine card to facilitate securing the side surface of the mezzanine card with respect to a top PCB. The mounting bracket also includes a first arm formed at the first end of the main body, a second arm formed at the second end of the main body, and at least one top rail coupled to the main body, wherein the top rail is configured to secure a top surface of the mezzanine card with respect to a top PCB.

Abstract translation: 用于将夹层卡固定在堆叠的单板计算机中的安装支架包括：主体，其包括第一端，相对的第二端，第一侧表面和相对的第二侧表面。 主体的尺寸设置成沿着夹层卡的侧面定位，其中第一侧表面或第二侧表面接触夹层卡的侧表面，以便于夹紧夹层卡相对于顶板的侧表面 PCB。 安装支架还包括形成在主体的第一端的第一臂，形成在主体的第二端的第二臂和耦合到主体的至少一个顶部导轨，其中顶部导轨被配置成 相对于顶部PCB固定夹层卡的顶面。

公开(公告)号：US08091224B2

公开(公告)日：2012-01-10

申请号：US12246200

申请日：2008-10-06

Applicant: David S. Slaton ,  David L. McDonald ,  Shreenath S. Perlaguri

Inventor： David S. Slaton ,  David L. McDonald ,  Shreenath S. Perlaguri

IPC: H01R43/00 ,  H01R4/42

CPC classification number: H01R13/2442 ,  H01M2/1044 ,  H05K1/182 ,  H05K3/301 ,  H05K2201/10037 ,  H05K2201/10325 ,  H05K2201/10454 ,  H05K2201/10643 ,  Y10T29/49108 ,  Y10T29/4913 ,  Y10T29/49153 ,  Y10T29/49174 ,  Y10T29/49176 ,  Y10T29/49204

Abstract: A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.

Abstract translation: 描述了一种用于在嵌入式系统内耦合电池的方法。 该方法包括创建延伸穿过印刷电路板（PCB）的孔，将电池的一部分插入到孔中，以及将电池电耦合到至少一个触点。

公开(公告)号：US07679916B2

公开(公告)日：2010-03-16

申请号：US11608384

申请日：2006-12-08

Applicant: Chris Erwin Orr ,  David S. Slaton

Inventor： Chris Erwin Orr ,  David S. Slaton

IPC: H05K7/20

CPC classification number: H05K1/0203 ,  B82Y10/00 ,  F28D15/00 ,  F28D15/0266 ,  F28D2015/0225 ,  F28F3/12 ,  H01L23/467 ,  H01L2224/16 ,  H05K1/0272 ,  H05K1/112 ,  H05K2201/026 ,  H05K2201/064

Abstract: A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.

Abstract translation: 提供了一种从电子设备提取热量的系统。 该系统包括位于印刷电路板内的散热装置，以形成板内散热器结构和设置在散热装置中的流体传热介质。 介质通过散热装置循环，从电子设备携带热量。

公开(公告)号：US20160081177A1

公开(公告)日：2016-03-17

申请号：US14787552

申请日：2013-04-29

Applicant: GE INTELLIGENT PLATFORMS EMBEDDED SYSTEMS, INC.

Inventor： Graham Charles KIRK ,  Zeshan Jabar HUSSAIN

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H05K7/1404 ,  H05K7/20545

Abstract: A circuit card assembly includes a heat sink, a locking mechanism, a first thermal path, and a second thermal path. The heat sink couples to a circuit board and has an upper surface and a lower surface. The heat sink has a channel extending downward along the upper surface of the heat sink. The locking mechanism is disposed within the channel and includes a plurality of solid wedges movably arranged within the channel. Movement of the wedges is effective to secure the circuit card assembly to a holder. The first thermal path extends from the circuit board through the heat sink to the lower surface of the heat sink and removes thermal energy from the circuit board. The second thermal path is formed from the circuit board, through the heat sink, and then through the wedges to the holder. The second thermal path removes thermal energy from the circuit board that is greater than a leakage amount.

Abstract translation: 电路卡组件包括散热器，锁定机构，第一热路径和第二热路径。 散热器耦合到电路板并且具有上表面和下表面。 散热器具有沿散热器的上表面向下延伸的通道。 锁定机构设置在通道内，并且包括可移动地布置在通道内的多个实心楔。 楔子的移动有效地将电路卡组件固定到支架上。 第一个热路径从电路板通过散热片延伸到散热器的下表面，并从电路板上去除热能。 第二个热路由电路板形成，通过散热片，然后通过楔形物到支架。 第二热路径从电路板去除大于泄漏量的热能。