Embodiments relate to an apparatus for coating a photoresist layer and a photolithography method using the apparatus. In embodiments, the apparatus may include a rotatable wafer support for supporting a wafer to be coated with a photoresist layer, a beam nozzle for performing WEE (Wafer Edge Exposure) with respect to a photoresist layer at an edge of the wafer on the wafer support, and a spray nozzle for spraying an alkali solution onto an edge of the wafer exposed through the beam nozzle.