Invention Grant
US07687339B1 Methods for fabricating FinFET structures having different channel lengths
有权
制造具有不同沟道长度的FinFET结构的方法
- Patent Title: Methods for fabricating FinFET structures having different channel lengths
- Patent Title (中): 制造具有不同沟道长度的FinFET结构的方法
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Application No.: US12365303Application Date: 2009-02-04
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Publication No.: US07687339B1Publication Date: 2010-03-30
- Inventor: Richard Schultz , Frank Scott Johnson
- Applicant: Richard Schultz , Frank Scott Johnson
- Applicant Address: US TX Austin
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US TX Austin
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/8234

Abstract:
Methods for fabricating a FinFET structure are provided. One method comprises forming a hard mask layer on a gate-forming material layer having a first portion and a second portion. A plurality of mandrels are fabricated on the hard mask layer and overlying the first portion and the second portion of the gate-forming material layer. A sidewall spacer material layer is deposited overlying the plurality of mandrels. The sidewall spacer material layer overlying the first portion of the gate-forming material layer is partially etched. Sidewall spacers are fabricated from the sidewall spacer material layer, the sidewall spacers being adjacent sidewalls of the plurality of mandrels. The plurality of mandrels are removed, the hard mask layer is etched using the sidewall spacers as an etch mask, and the gate-forming material layer is etched using the etched hard mask layer as an etch mask.
Information query
IPC分类: