Invention Grant
US07687366B2 Pre-patterned thin film capacitor and method for embedding same in a package substrate
有权
预先构图的薄膜电容器和用于将其嵌入封装衬底中的方法
- Patent Title: Pre-patterned thin film capacitor and method for embedding same in a package substrate
- Patent Title (中): 预先构图的薄膜电容器和用于将其嵌入封装衬底中的方法
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Application No.: US11601101Application Date: 2006-11-17
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Publication No.: US07687366B2Publication Date: 2010-03-30
- Inventor: Yongki Min
- Applicant: Yongki Min
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01G9/00
Abstract:
An embedded passive structure, its method of formation, and its integration onto a substrate during fabrication are disclosed. In one embodiment, the embedded passive structure is a thin film capacitor (TFC) formed using a thin film laminate that has been mounted onto a substrate. The TFC's capacitor dielectric and/or lower electrode layers are patterned in such a way as to reduce damage and improve cycle time. In one embodiment, the capacitor dielectric has a high dielectric constant and the substrate is an organic packaging substrate.
Public/Granted literature
- US20070065973A1 Pre-patterned thin film capacitor and method for embedding same in a package substrate Public/Granted day:2007-03-22
Information query
IPC分类:
