Invention Grant
- Patent Title: Integrated circuit packages, systems, and methods
- Patent Title (中): 集成电路封装，系统和方法
-
Application No.: US12039077Application Date: 2008-02-28
-
Publication No.: US07687905B2Publication Date: 2010-03-30
- Inventor: Brent S. Stone , Dustin P. Wood , Kaladhar Radhakrishnan
- Applicant: Brent S. Stone , Dustin P. Wood , Kaladhar Radhakrishnan
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L21/02
Abstract:
An integrated circuit package includes a first capacitor supported by a surface of a substrate, and a second capacitor supported by the surface of the substrate. The first capacitor is within a die shadow region, and the second capacitor lies outside of the die shadow region.
Public/Granted literature
- US20080142962A1 INTEGRATED CIRCUIT PACKAGES, SYSTEMS, AND METHODS Public/Granted day:2008-06-19
Information query
IPC分类:
