Invention Grant
- Patent Title: System and method for controlling coating width of electrode plate
- Patent Title (中): 控制电极板涂层宽度的系统和方法
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Application No.: US11727207Application Date: 2007-03-23
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Publication No.: US07690326B2Publication Date: 2010-04-06
- Inventor: Yutaka Wakai , Kaoru Okinaga , Yukio Koike , Tomofumi Yanagi
- Applicant: Yutaka Wakai , Kaoru Okinaga , Yukio Koike , Tomofumi Yanagi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-083163 20060324
- Main IPC: B05C11/00
- IPC: B05C11/00

Abstract:
A system for controlling the coating width of an electrode plate, The system includes: a coating device which ejects a paste at a predetermined width from each of a plurality of slit nozzles toward a fed core substrate to form a coating layer on the surface of the core substrate; a gap controlling device which controls the gap between the slit nozzles of the coating device and the core substrate; a coating width measuring device which measures the width of the coating layer on the surface of the core substrate; and a controlling unit which controls the gap controlling device based on the results obtained by comparing the measured coating width with a predetermined coating width. In this system, the stripe-shaped coating layer is formed without using a masking tape, and the width of the coating layer is controlled with high accuracy.
Public/Granted literature
- US20070248745A1 System and method for controlling coating width of electrode plate Public/Granted day:2007-10-25
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