The invention is directed to a wafer cleaning process for being applied on a wafer after an etching process is performed on the wafer, wherein the wafer has a wafer center, a wafer radius and a wafer circumference. The wafer cleaning process comprises a step of dispensing a cleaning solution over the wafer by using a dispenser while the dispenser is moving back and forth along a swing path over the wafer around the wafer center, wherein the wafer center is projected to a midpoint of the swing path.