A method for removing a photoresist layer is provided. The method is suitable for a dielectric layer, wherein the dielectric layer has a patterned photoresist layer formed thereon and a metal silicide layer disposed thereunder and there is an etching stop layer disposed between the dielectric layer and the metal silicide layer. The method comprises steps of removing a portion of the dielectric layer by using the patterned photoresist layer as a mask so as to form an opening, wherein the opening exposes a portion of the etching stop layer above the metal silicide layer. the patterned photoresist layer is removed by using an oxygen-free plasma.