Invention Grant
- Patent Title: Apparatus for housing a micromechanical structure
- Patent Title (中): 用于容纳微机械结构的装置
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Application No.: US11864448Application Date: 2007-09-28
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Publication No.: US07692317B2Publication Date: 2010-04-06
- Inventor: Martin Franosch , Andreas Meckes , Winfried Nessler , Klaus-Gunter Oppermann
- Applicant: Martin Franosch , Andreas Meckes , Winfried Nessler , Klaus-Gunter Oppermann
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dickstein, Shapiro, LLP.
- Priority: DE10353767 20031117
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.
Public/Granted literature
- US20080017974A1 APPARATUS FOR HOUSING A MICROMECHANICAL STRUCTURE Public/Granted day:2008-01-24
Information query
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