Capacitive decoupling circuits and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor chip with a first power rail for a first no-load bias level and a ground rail. A first voltage divider is electrically coupled between the first power rail and the ground rail and has a midpoint node. A first pair of capacitors is electrically coupled between the first power rail, the midpoint node and the ground rail to provide capacitive decoupling for power delivered to the first power rail. A second power rail has a second no-load bias less than the first no-load bias. A second pair of capacitors is electrically coupled between the ground rail and the second power rail to provide capacitive decoupling for power delivered to the second power rail.