Invention Grant
- Patent Title: Side-view optical diode package and fabricating process thereof
- Patent Title (中): 侧视光二极管封装及其制造工艺
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Application No.: US11954679Application Date: 2007-12-12
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Publication No.: US07701050B2Publication Date: 2010-04-20
- Inventor: Chih-Ming Chen , Deng-Huei Hwang , Ching-Chi Cheng , An-Nong Wen
- Applicant: Chih-Ming Chen , Deng-Huei Hwang , Ching-Chi Cheng , An-Nong Wen
- Applicant Address: TW Hsinchu
- Assignee: Silicon Base Development Inc.
- Current Assignee: Silicon Base Development Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Kirton & McConkie
- Agent Evan R. Witt
- Priority: TW95146743A 20061213; TW96118448A 20070523
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L29/267 ; H01L29/22 ; H01L31/0232 ; H01L31/0203
Abstract:
A side-view optical diode package is mounted on a printed circuit board with at least a solder bump. The side-view optical diode package includes a silicon substrate, a holding space, a bonding surface and a positioning structure. The silicon substrate has a first surface and a second surface. The holding space has a top opening in the first surface and a bottom for holding an optical diode thereon. The bonding surface is disposed at a lateral side of the silicon substrate and bonded onto the printed circuit board. The positioning structure has at least a solder-receiving portion beside the bonding surface and corresponding to the solder bump. The solder bump is molten during a soldering process and received in the solder-receiving portion, thereby facilitating positioning the silicon substrate on the printed circuit board.
Public/Granted literature
- US20080142832A1 SIDE-VIEW OPTICAL DIODE PACKAGE AND FABRICATING PROCESS THEREOF Public/Granted day:2008-06-19
Information query
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