Invention Grant
- Patent Title: Package level noise isolation
- Patent Title (中): 封装级噪声隔离
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Application No.: US11647897Application Date: 2006-12-28
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Publication No.: US07709934B2Publication Date: 2010-05-04
- Inventor: Xiang Yin Zeng , Jiangqi He , Guizhen Zheng
- Applicant: Xiang Yin Zeng , Jiangqi He , Guizhen Zheng
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/58 ; H01L23/62 ; H01L23/053 ; H01L23/12 ; H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A package may include a substrate provided with noise absorbing material. The noise absorbing material may absorb noise from a signal path in the substrate to prevent the noise from reaching other signals or signal paths.
Public/Granted literature
- US20080157294A1 Package level noise isolation Public/Granted day:2008-07-03
Information query
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