Invention Grant
- Patent Title: Pump ring
- Patent Title (中): 泵环
-
Application No.: US11162122Application Date: 2005-08-30
-
Publication No.: US07726953B2Publication Date: 2010-06-01
- Inventor: Jian-Shing Lai , Ying-Yi Chang
- Applicant: Jian-Shing Lai , Ying-Yi Chang
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Main IPC: C23C16/00
- IPC: C23C16/00

Abstract:
A pump ring. The pump ring is suitable for a reaction chamber and capable for extracting gas from the reaction chamber in a uniform gas flow rate. The pump ring comprises a ring body and a top ring part located on the ring body. The top ring part is apart from an inner wall of the reaction chamber with a fixed distance. Therefore, a gas-extraction path composed of the reaction chamber, the ring body and the top ring part is unobstructed. Hence, the turbulence flow of the extracted gas can be efficiently suppressed and the problems of the accumulation of the impurities and reaction chamber contamination can be solved.
Public/Granted literature
- US20070051309A1 PUMP RING Public/Granted day:2007-03-08
Information query
IPC分类: