Invention Grant
US07772096B2 Formation of SOI by oxidation of silicon with engineered porosity gradient
失效
通过工程化孔隙度梯度的硅氧化形成SOI
- Patent Title: Formation of SOI by oxidation of silicon with engineered porosity gradient
- Patent Title (中): 通过工程化孔隙度梯度的硅氧化形成SOI
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Application No.: US12170459Application Date: 2008-07-10
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Publication No.: US07772096B2Publication Date: 2010-08-10
- Inventor: Joel P. DeSouza , Keith E. Fogel , Alexander Reznicek , Devendra Sadana
- Applicant: Joel P. DeSouza , Keith E. Fogel , Alexander Reznicek , Devendra Sadana
- Applicant Address: US NY Armonk
- Assignee: International Machines Corporation
- Current Assignee: International Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent H. Daniel Schnurmann; Daryl K. Neff
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/36

Abstract:
A method is provided for making a silicon-on-insulator substrate. Such method can include epitaxially growing a highly p-type doped silicon-containing layer onto a major surface of an underlying semiconductor region of a substrate. Subsequently, a non-highly p-type doped silicon-containing layer may be epitaxially grown onto a major surface of the p-type highly-doped epitaxial layer to cover the highly p-type doped epitaxial layer. The overlying non-highly p-type doped epitaxial layer can have a dopant concentration substantially lower than the dopant concentration of the highly p-type doped epitaxial layer. The substrate can then be processed to form a buried oxide layer selectively by oxidizing at least portions of the highly p-type doped epitaxial layer covered by the non-highly p-type doped epitaxial layer, the buried oxide layer separating the overlying monocrystalline semiconductor layer from the underlying semiconductor region. Such processing can be performed while simultaneously annealing the non-highly p-type doped epitaxial layer.
Public/Granted literature
- US20100006985A1 FORMATION OF SOI BY OXIDATION OF SILICON WITH ENGINEERED POROSITY GRADIENT Public/Granted day:2010-01-14
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