Invention Grant
- Patent Title: Die seal ring and wafer having the same
- Patent Title (中): 模具密封圈和晶片具有相同的密封环
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Application No.: US11771122Application Date: 2007-06-29
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Publication No.: US07795704B2Publication Date: 2010-09-14
- Inventor: Ping-Chang Wu
- Applicant: Ping-Chang Wu
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Agent Justin King
- Main IPC: H01L23/544
- IPC: H01L23/544
Abstract:
A die seal ring disposed in a die and surrounding an integrated circuit region of the die is described. The die seal ring has at least two different local widths.
Public/Granted literature
- US20090001522A1 DIE SEAL RING AND WAFER HAVING THE SAME Public/Granted day:2009-01-01
Information query
IPC分类:
