A method for decreasing impedance of a power source in a printed circuit board includes: (a) forming a first metal plane over a first layer of the printed circuit board; (b) forming a second metal plane and a third metal plane over a second layer of the printed circuit board; (c) forming a dielectric layer between the first layer and the second layer of the printed circuit board for insulating the first layer from the second layer; and (d) connecting the second metal plane to an electric potential different from an electric potential of the first metal plane and the third metal plane.