公开(公告)号：US20060068582A1

公开(公告)日：2006-03-30

申请号：US10906073

申请日：2005-02-02

Applicant: Thonas Su

Inventor： Thonas Su

IPC: H01L21/50

CPC classification number: H05K1/0237 ,  H05K1/0227 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09345 ,  H05K2201/09663 ,  Y10T29/49155

Abstract: A method for decreasing impedance of a power source in a printed circuit board includes: (a) forming a first metal plane over a first layer of the printed circuit board; (b) forming a second metal plane and a third metal plane over a second layer of the printed circuit board; (c) forming a dielectric layer between the first layer and the second layer of the printed circuit board for insulating the first layer from the second layer; and (d) connecting the second metal plane to an electric potential different from an electric potential of the first metal plane and the third metal plane.

Abstract translation: 一种用于降低印刷电路板中的电源的阻抗的方法包括：（a）在印刷电路板的第一层上形成第一金属平面; （b）在所述印刷电路板的第二层上形成第二金属平面和第三金属平面; （c）在印刷电路板的第一层和第二层之间形成绝缘层，用于使第一层与第二层绝缘; 和（d）将第二金属平面连接到不同于第一金属平面和第三金属平面的电位的电位。

公开(公告)号：US07797824B2

公开(公告)日：2010-09-21

申请号：US10906073

申请日：2005-02-02

Applicant: Thonas Su

Inventor： Thonas Su

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0237 ,  H05K1/0227 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09345 ,  H05K2201/09663 ,  Y10T29/49155

Abstract: A method for decreasing impedance of a power source in a printed circuit board includes: (a) forming a first metal plane over a first layer of the printed circuit board; (b) forming a second metal plane and a third metal plane over a second layer of the printed circuit board; (c) forming a dielectric layer between the first layer and the second layer of the printed circuit board for insulating the first layer from the second layer; and (d) connecting the second metal plane to an electric potential different from an electric potential of the first metal plane and the third metal plane.

Abstract translation: 一种用于降低印刷电路板中的电源的阻抗的方法包括：（a）在印刷电路板的第一层上形成第一金属平面; （b）在所述印刷电路板的第二层上形成第二金属平面和第三金属平面; （c）在印刷电路板的第一层和第二层之间形成绝缘层，用于使第一层与第二层绝缘; 和（d）将第二金属平面连接到不同于第一金属平面和第三金属平面的电位的电位。