Invention Grant
- Patent Title: Thermal treatment of an implantable medical device
- Patent Title (中): 可植入医疗器械的热处理
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Application No.: US10856984Application Date: 2004-05-27
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Publication No.: US07807211B2Publication Date: 2010-10-05
- Inventor: Syed F. A. Hossainy , Yiwen Tang , Manish Gada
- Applicant: Syed F. A. Hossainy , Yiwen Tang , Manish Gada
- Applicant Address: US CA Santa Clara
- Assignee: Advanced Cardiovascular Systems, Inc.
- Current Assignee: Advanced Cardiovascular Systems, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Squire, Sanders & Dempsey L.L.P
- Main IPC: B05D3/02
- IPC: B05D3/02 ; A61L27/00 ; A61F2/06
Abstract:
A method of manufacturing an implantable medical device, such as a drug eluting stent, is disclosed. The method includes subjecting an implantable medical device that includes a polymer to a thermal condition. The thermal condition can result in reduction of the rate of release of an active agent from the device subsequent to the implantation of the device and/or improve the mechanical properties of a polymeric coating on the device.
Public/Granted literature
- US20050233062A1 Thermal treatment of an implantable medical device Public/Granted day:2005-10-20
Information query
