Invention Grant
- Patent Title: Light emitting apparatus
- Patent Title (中): 发光装置
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Application No.: US11362687Application Date: 2006-02-27
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Publication No.: US07829903B2Publication Date: 2010-11-09
- Inventor: Hitoshi Takeda , Masayasu Ito , Tsukasa Tokida
- Applicant: Hitoshi Takeda , Masayasu Ito , Tsukasa Tokida
- Applicant Address: JP Tokyo
- Assignee: Koito Manufacturing Co., Ltd.
- Current Assignee: Koito Manufacturing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Osha Liang LLP
- Priority: JP2005-059548 20050303
- Main IPC: H01L29/201
- IPC: H01L29/201
Abstract:
A light emitting apparatus includes a semiconductor light emitting element mounted on a circuit board; a lighting circuit part mounted on the circuit board; and a cover which covers the semiconductor light emitting element and the lighting circuit part. The lighting circuit part converts a voltage inputted from a power source into electromagnetic energy and propagates the converted electromagnetic energy to the semiconductor light emitting element as light emitting energy, and the cover transmits light from the semiconductor light emitting element.
Public/Granted literature
- US20060197444A1 Light emitting apparatus Public/Granted day:2006-09-07
Information query
IPC分类:
