Invention Grant
- Patent Title: Method of manufacturing an imprinting template using a semiconductor manufacturing process and the imprinting template obtained
- Patent Title (中): 使用半导体制造工艺制造压印模板的方法和获得的压印模板
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Application No.: US11669168Application Date: 2007-01-31
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Publication No.: US07846345B2Publication Date: 2010-12-07
- Inventor: Pei-Yu Chou , Jiunn-Hsiung Liao
- Applicant: Pei-Yu Chou , Jiunn-Hsiung Liao
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: C03C15/00
- IPC: C03C15/00 ; C03C25/68 ; C23F1/00

Abstract:
The method of manufacturing an imprinting template according to the present invention utilizes a semiconductor manufacturing process and comprises a step of etching an oxide layer having a thickness of from 1000 to 8000 angstroms on a substrate by a microlithography and etching process, to form a pattern having a plurality of pillar-shaped holes, thereby forming an imprinting plate having a plurality of pillar-shaped holes. A material layer may be filled into the holes and a part of the oxide layer is removed to form an imprinting template having a plurality of pillar-shaped protrusions. Alternatively, a silicon substrate may be used instead of the substrate and the oxide layer. The imprinting template according to the present invention has advantages of mass production, fast production, and low cost, and is suitable to serve as the imprinting plate for making photonic crystals.
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