Invention Grant
- Patent Title: Curing silicone composition and cured product thereof
- Patent Title (中): 固化硅酮组合物及其固化产物
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Application No.: US10584655Application Date: 2004-12-20
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Publication No.: US07863399B2Publication Date: 2011-01-04
- Inventor: Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Hiroji Enami
- Applicant: Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Hiroji Enami
- Applicant Address: JP Tokyo
- Assignee: Dow Corning Toray Company, Ltd
- Current Assignee: Dow Corning Toray Company, Ltd
- Current Assignee Address: JP Tokyo
- Agency: Howard & Howard Attorneys PLLC
- Priority: JP2003-433628 20031226
- International Application: PCT/JP2004/019489 WO 20041220
- International Announcement: WO2005/063843 WO 20050714
- Main IPC: C08G77/00
- IPC: C08G77/00
Abstract:
A curable silicone composition comprising: (A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein; (B) a linear-chain organopolysiloxane having at least two univalent hydroxyl groups with epoxy groups that are free of aromatic rings; and (C) a curing accelerator.
Public/Granted literature
- US20070282058A1 Curing Silicone Composition and Cured Product Thereof Public/Granted day:2007-12-06
Information query
