公开(公告)号：US08802506B2

公开(公告)日：2014-08-12

申请号：US12280248

申请日：2007-02-14

Applicant: Minoru Isshiki ,  Tomoko Kato ,  Yoshitsugu Morita ,  Hiroshi Ueki

Inventor： Minoru Isshiki ,  Tomoko Kato ,  Yoshitsugu Morita ,  Hiroshi Ueki

IPC: H01L21/00

CPC classification number: B29C43/18 ,  B29C43/50 ,  C08L83/06 ,  C08L83/14 ,  H01L21/565 ,  H01L23/293 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching.

Abstract translation: 一种制造半导体器件的方法，该半导体器件通过将未密封的半导体器件放置在模具中并将供入到模具和未密封的半导体器件之间的空间中的可固化的硅氧烷组合物压缩成型，将密封在固化的硅氧烷体中的方法进行压缩成型 上述可固化硅氧烷组合物至少包含以下组分：（A）含环氧基的硅氧烷和（B）环氧树脂的固化剂; 可以减少半导体芯片和电路板翘曲，提高表面耐擦伤性。

公开(公告)号：US08309652B2

公开(公告)日：2012-11-13

申请号：US11912631

申请日：2006-04-27

Applicant: Yoshitsugu Morita ,  Minoru Isshiki ,  Hiroshi Ueki

Inventor： Yoshitsugu Morita ,  Minoru Isshiki ,  Hiroshi Ueki

IPC: C08L83/04

CPC classification number: C08L83/06 ,  C08K3/08 ,  C08L83/04 ,  C09D183/06 ,  C08L83/00

Abstract: A curable silicone composition comprising: (A) an organopolysiloxane that is represented by the average unit formula: (R13SiO1/2)a(R22SiO2/2)b(R3SiO3/2)c(SiO4/2)d (wherein R1, R2, and R3 are each independently selected from substituted or unsubstituted monovalent hydrocarbon groups and epoxy-functional monovalent organic groups, with the proviso that at least 20 mole % of R3 are aryl groups, and a, b, c, and d are numbers that satisfy 0≦a≦0.8, 0≦b≦0.8, 0.2≦c≦0.9, 0≦d

Abstract translation: 一种可固化有机硅组合物，其包含：（A）由平均单元式表示的有机聚硅氧烷：（R 13 SiO 1/2）a（R 22 SiO 2/2）b（R 3 SiO 3/2）c（SiO 4/2）d（其中R 1，R 2， 和R 3各自独立地选自取代或未取代的单价烃基和环氧官能的一价有机基团，条件是至少20摩尔％的R 3是芳基，a，b，c和d是满足0＆nlE的数 ; a＆nlE; 0.8,0和nlE; b＆nlE; 0.8,0.2＆nlE; c＆nlE; 0.9,0＆amp; nlE; d <0.8，a + b + c + d = 1），并且具有至少两个上述环氧官能单价有机 每个分子中的基团; （B）具有能够与环氧基反应的基团的化合物; （C）固化促进剂; 和（D）导热填料，具有优异的处理特性，并快速固化，得到高导热性，非常柔性，高粘合性和非常阻燃的固化产物。

公开(公告)号：US20070273051A1

公开(公告)日：2007-11-29

申请号：US11832984

申请日：2007-08-02

Applicant: Tomoko Kato ,  Minoru Isshiki

Inventor： Tomoko Kato ,  Minoru Isshiki

IPC: H01L23/29

CPC classification number: C08K5/56 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08L83/04 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/1301 ,  H01L2924/181 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A curable organopolysiloxane composition capable of forming cured products of superior optical transmittance exhibiting little heat-induced yellowing over time. A semiconductor device having semiconductor elements encapsulated in a cured product of the composition. The composition includes (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule and bearing silicon-bonded aryl groups, whose content relative to all silicon-bonded organic groups is not less than 40 mol %, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, and (C) an organosiloxane oligomer complex of platinum, where the oligomer has not more than eight silicon atoms per molecule and bears silicon-bonded alkenyl groups and silicon-bonded aryl groups.

Abstract translation: 一种可固化的有机基聚硅氧烷组合物，其能够形成具有优异光透射率的固化产物，其随着时间的推移几乎不发生热引起的黄变。 一种具有封装在该组合物的固化产物中的半导体元件的半导体器件。 该组合物包括（A）每分子具有至少两个硅键合的烯基并且具有硅键合的芳基的有机聚硅氧烷，其相对于所有与硅键合的有机基团的含量不小于40摩尔％，（B）有机聚硅氧烷 每分子具有至少两个硅键合的氢原子，和（C）铂的有机硅氧烷低聚物络合物，其中低聚物每分子具有不超过8个硅原子并具有硅键合的烯基和与硅键合的芳基。

公开(公告)号：US06761947B2

公开(公告)日：2004-07-13

申请号：US10347564

申请日：2003-01-17

Applicant: Kimio Yamakawa ,  Minoru Isshiki ,  Yoshiko Otani ,  Katsutoshi Mine

Inventor： Kimio Yamakawa ,  Minoru Isshiki ,  Yoshiko Otani ,  Katsutoshi Mine

IPC: B32B3300

CPC classification number: H01L24/83 ,  C09J7/10 ,  C09J183/04 ,  C09J2203/326 ,  C09J2483/00 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/8547 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10S428/914 ,  Y10T428/14 ,  Y10T428/1452 ,  Y10T428/1457 ,  Y10T428/1462 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/31663 ,  Y10T428/31786 ,  H01L2924/0715 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A method of manufacturing a silicone-based adhesive sheet comprising (i) curing a silicone composition to form a cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A semiconductor device comprising a semiconductor chip, a chip attachment component, and the above-mentioned silicone-based adhesive sheet, wherein the semiconductor chip is bonded to the chip attachment component with the silicone-based adhesive sheet.

Abstract translation: 一种通过包括（i）固化硅氧烷组合物以形成基本上固化的产品同时组合物位于背衬材料之间的硅氧烷基粘合片，其中至少一种背衬材料具有包含氧原子和/或硫的表面 与硅氧烷组合物和背衬材料接触的原子可从固化产物中释放，和（ii）将固化产物与背衬材料分离。 一种制造硅氧烷基粘合片的方法，包括（i）固化硅氧烷组合物以形成固化产物，同时组合物位于背衬材料之间，其中至少一种背衬材料具有包含氧原子和/或硫原子的表面 与硅氧烷组合物接触并且背衬材料可从固化产物中释放，和（ii）将固化产物与背衬材料分离。 一种半导体器件，包括半导体芯片，芯片附着部件和上述硅氧烷基粘合片，其中半导体芯片与硅氧烷基粘合片结合到芯片附接部件。

公开(公告)号：US06750550B1

公开(公告)日：2004-06-15

申请号：US09597218

申请日：2000-06-20

Applicant: Kimio Yamakawa ,  Minoru Isshiki ,  Katsutoshi Mine

Inventor： Kimio Yamakawa ,  Minoru Isshiki ,  Katsutoshi Mine

IPC: H01L2348

CPC classification number: H01L24/32 ,  C08G59/306 ,  C08G59/3254 ,  C08K7/18 ,  C08L2666/54 ,  C09J11/02 ,  C09J183/04 ,  H01L21/563 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00

Abstract: An adhesive composition for bonding semiconductor chips to their chip mounting components comprising a curable polymer composition comprising from 1 to 900 weight-ppm spherical filler having an average particle size of from 10 to 100 &mgr;m and a major axis-to-minor axis ratio of from 1 to 1.5. Also, semiconductor devices in which a semiconductor chip therein is bonded to its chip mounting component by the aforesaid adhesive composition.

Abstract translation: 一种用于将半导体芯片接合到其芯片安装部件的粘合剂组合物，其包含可固化聚合物组合物，其包含1至900重量ppm的平均粒度为10至100μm的球形填料，并且长轴与短轴比为 1〜1.5。 此外，其中通过上述粘合剂组合物将其中的半导体芯片结合到其芯片安装部件的半导体器件。

公开(公告)号：US06513680B2

公开(公告)日：2003-02-04

申请号：US09841895

申请日：2001-04-25

Applicant: Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Junji Nakanishi ,  Tomoko Kato ,  Minoru Isshiki ,  Kimio Yamakawa

Inventor： Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Junji Nakanishi ,  Tomoko Kato ,  Minoru Isshiki ,  Kimio Yamakawa

IPC: G01F1100

CPC classification number: B65D81/2023 ,  B65D83/0005

Abstract: A paste dispensing container comprising a cylindrical container having positioned therein a piston slidable along the walls of the container, a first end closed with a cap to seal paste within the container, a connecting portion at a second end of the container for connection with a pressurized fluid supply, and a leakage preventing cover having an air orifice covering the second end of the container. The paste dispensing container can be vacuum packaged in a gas-impermeable film for shipping and storage to prevent exposure of the paste contained therein to air.

公开(公告)号：US06304000B1

公开(公告)日：2001-10-16

申请号：US09706561

申请日：2000-11-06

Applicant: Minoru Isshiki ,  Katsutoshi Mine ,  Yoshiko Otani ,  Kimio Yamakawa

Inventor： Minoru Isshiki ,  Katsutoshi Mine ,  Yoshiko Otani ,  Kimio Yamakawa

IPC: H01L2348

CPC classification number: H01L24/29 ,  C08L83/00 ,  C09J7/10 ,  C09J183/04 ,  C09J2203/326 ,  C09J2483/00 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/0715 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A semiconductor device comprising a semiconductor chip, a semiconductor chip attachment site facing the semiconductor chip, and an adhesive silicone sheet bonding the semiconductor chip to the chip attachment site, wherein at least the surfaces of the sheet that connect the semiconductor chip and chip attachment site are a semi-cured product of a curable silicone composition.

Abstract translation: 一种半导体器件，包括半导体芯片，面向半导体芯片的半导体芯片附着部位和将半导体芯片接合到芯片安装部位的粘合性硅树脂片，其中至少连接半导体芯片和芯片附接部位的片材的表面 是可固化的有机硅组合物的半固化产物。

公开(公告)号：US06235862B1

公开(公告)日：2001-05-22

申请号：US09070078

申请日：1998-04-30

Applicant: Minoru Isshiki ,  Katsutoshi Mine ,  Yoshiko Otani ,  Kimio Yamakawa

Inventor： Minoru Isshiki ,  Katsutoshi Mine ,  Yoshiko Otani ,  Kimio Yamakawa

IPC: H01L2144

CPC classification number: H01L24/29 ,  C08L83/00 ,  C09J7/10 ,  C09J183/04 ,  C09J2203/326 ,  C09J2483/00 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/0715 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: An adhesive silicone sheet that enroute to its complete cure is inhibited from releasing low-viscosity silicone oil, that provides excellent bond between a semiconductor chip and the corresponding chip attachment site, and that as a consequence of these features supports the fabrication of highly reliable semiconductor devices, The adhesive silicone sheet is produced by a very efficient method which yields an adhesive silicone sheet having particularly good adhesiveness. The siliocone adhesive sheet is used to produce highly reliable semiconductor devices in which the semiconductor chip has been bonded to its attachment site using the subject adhesive silicone sheet.

Abstract translation: 阻止其完全固化的粘性硅树脂片材释放出低粘度硅油，从而在半导体芯片和相应的芯片附着部位之间提供优异的粘合性，并且作为这些特征的结果支持制造高度可靠的半导体 粘合性硅胶片是通过非常有效的方法制造的，其产生具有特别好的粘合性的粘合性硅树脂片。 硅胶粘合片用于制造高可靠性的半导体器件，其中半导体芯片已经使用主题粘合性硅树脂片粘合到其附着位置。

公开(公告)号：US06231974B1

公开(公告)日：2001-05-15

申请号：US09082889

申请日：1998-05-21

Applicant: Kimio Yamakawa ,  Minoru Isshiki ,  Yoshiko Otani ,  Katsutoshi Mine

Inventor： Kimio Yamakawa ,  Minoru Isshiki ,  Yoshiko Otani ,  Katsutoshi Mine

IPC: B32B712

CPC classification number: H01L24/83 ,  C09J7/22 ,  C09J7/35 ,  C09J2201/128 ,  C09J2483/00 ,  H01L24/29 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/8388 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10T428/28 ,  Y10T428/2813 ,  Y10T428/2848 ,  H01L2924/00014 ,  H01L2924/0715 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: To provides a hot-melt adhesive sheet that provides very precise bonding and a stress-relaxation capacity. Also, to provide highly reliable semiconductor devices in which the semiconductor element is bonded to its element attachment site using this hot-melt adhesive sheet. Hot-melt adhesive sheet that characteristically has hot-melt adhesive on both surfaces of the sheet and spacer within the sheet. Also, semiconductor device characterized in that the semiconductor element therein is bonded to its element attachment site by the above-described hot-melt adhesive sheet.

Abstract translation: 提供提供非常精确的结合和应力松弛能力的热熔粘合片。 此外，为了提供使用该热熔粘合片将半导体元件结合到其元件安装部位的高度可靠的半导体器件。在片材的两个表面上特征性地具有热熔粘合剂的熔融粘合片和位于 片。 此外，半导体器件的特征在于，其中的半导体元件通过上述热熔粘合片粘合到其元件附着位置。

公开(公告)号：US08273815B2

公开(公告)日：2012-09-25

申请号：US12440824

申请日：2007-08-23

Applicant: Yoshitsugu Morita ,  Minoru Isshiki ,  Tomoko Kato

Inventor： Yoshitsugu Morita ,  Minoru Isshiki ,  Tomoko Kato

IPC: C08L83/04 ,  C08K3/38 ,  C08K3/14 ,  C08K3/22 ,  C08K3/08 ,  C08K3/34 ,  C08K3/28

CPC classification number: C08L83/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/70 ,  H01L2224/73253 ,  H01L2924/1301 ,  C08L83/00 ,  H01L2924/00

Abstract: A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for an epoxy resin; (C) a thermally conductive metal powder; and (D) a thermally conductive nonmetal powder; exhibits low viscosity, excellent handleability and curability and, when cured, forms a cured body of flexibility, low specific gravity, and excellent thermal conductivity. An electronic component sealed or adhesively bonded with use of a cured body obtained by curing the aforementioned composition provides high reliability.

Abstract translation: 至少包含以下组分的可固化有机硅组合物：（A）含环氧基的有机聚硅氧烷; （B）环氧树脂用固化剂; （C）导热金属粉末; 和（D）导热非金属粉末; 显示出低粘度，优异的可操作性和固化性，并且当固化时形成柔韧性，低比重和优异导热性的固化体。 使用通过固化上述组合物获得的固化体密封或粘合的电子部件提供高可靠性。