Invention Grant
- Patent Title: Thermally and electrically conductive interface
- Patent Title (中): 导电和导电接口
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Application No.: US12141257Application Date: 2008-06-18
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Publication No.: US07867353B2Publication Date: 2011-01-11
- Inventor: Sundaram Nand Kumar , Gary Sites , Bhavik Patel
- Applicant: Sundaram Nand Kumar , Gary Sites , Bhavik Patel
- Applicant Address: US IL Franklin Park
- Assignee: American Standard Circuits
- Current Assignee: American Standard Circuits
- Current Assignee Address: US IL Franklin Park
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B32B37/00 ; B32B9/04 ; B32B9/06 ; B32B11/06 ; B32B15/04 ; C09J5/00 ; B05D3/02

Abstract:
A thermally and electrically conductive material is provided as a mixture of a dimethylpolysiloxane, metal (or one metal coated with another metal) flakes and/or granules, a peroxide-based and/or a dimethyl hexane based catalyst, PTFE powder and a platinum based fire retardant. The thermally and electrically conductive material may be pre-formed into a film or pad and each side of the film protected with removable release layers. The thermally and electrically conductive material may alternatively be produced in a screen-printable paste. As such, a layer of the thermally and electrically conductive paste may be screen-printed on the metal surface in a complete sheet form or as a patterned film by using a stencil patterned screen mesh. Processes for manufacturing high- and low-frequency circuits that include the interface material are also provided.
Public/Granted literature
- US20080251199A1 Thermally and Electrically Conductive Interface Public/Granted day:2008-10-16
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