Invention Grant
US07869026B2 Targeted artifacts and methods for evaluating 3-D coordinate system measurement accuracy of optical 3-D measuring systems using such targeted artifacts
有权
用于评估使用这种目标人工制品的光学3-D测量系统的3-D坐标系测量精度的目标工件和方法
- Patent Title: Targeted artifacts and methods for evaluating 3-D coordinate system measurement accuracy of optical 3-D measuring systems using such targeted artifacts
- Patent Title (中): 用于评估使用这种目标人工制品的光学3-D测量系统的3-D坐标系测量精度的目标工件和方法
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Application No.: US11962278Application Date: 2007-12-21
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Publication No.: US07869026B2Publication Date: 2011-01-11
- Inventor: Jesse R. Boyer , Jeffry K. Pearson , Randall W. Joyner , Joseph D Drescher
- Applicant: Jesse R. Boyer , Jeffry K. Pearson , Randall W. Joyner , Joseph D Drescher
- Applicant Address: US CT Hartford
- Assignee: United Technologies Corp.
- Current Assignee: United Technologies Corp.
- Current Assignee Address: US CT Hartford
- Main IPC: G01J1/10
- IPC: G01J1/10 ; G01B11/14
Abstract:
A method for evaluating three-dimensional (3-D) coordinate system measurement accuracy of an optical 3-D measuring system using targeted artifacts is provided. In this regard, an exemplary embodiment of a method for evaluating 3-D coordinate system measurement accuracy using targeted artifacts comprises: taking a series of measurements from different positions and orientations using target dots on a targeted artifact with an optical 3-D measuring system; and calculating measurement errors using the series of measurements. An exemplary embodiment of a targeted artifact used with the method includes a base and target dots located on the base.
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