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US07884537B2 Pattern substrate including conductive pattern of overlapping circular patterns disposed on substrate 有权
图案衬底包括布置在衬底上的重叠圆形图案的导电图案

  • Patent Title: Pattern substrate including conductive pattern of overlapping circular patterns disposed on substrate
  • Patent Title (中): 图案衬底包括布置在衬底上的重叠圆形图案的导电图案
  • Application No.: US12029967
    Application Date: 2008-02-12
  • Publication No.: US07884537B2
    Publication Date: 2011-02-08
  • Inventor: Takuro Sekiya
  • Applicant: Takuro Sekiya
  • Applicant Address: JP Tokyo
  • Assignee: Ricoh Company, Ltd.
  • Current Assignee: Ricoh Company, Ltd.
  • Current Assignee Address: JP Tokyo
  • Agency: Cooper & Dunham LLP
  • Priority: JP2000-051102 20000228; JP2000-358111 20001124
  • Main IPC: H01J63/04
  • IPC: H01J63/04
Pattern substrate including conductive pattern of overlapping circular patterns disposed on substrate
Abstract:
A pattern substrate including a conductive pattern of overlapping circular patterns disposed on a substrate is provided.
Abstract(Chinese):

提供了包括设置在基板上的重叠圆形图案的导电图案的图案基板。

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