Invention Grant
- Patent Title: Method of forming wiring of light emitting device, substrate for mounting light emitting device, display, back light, illuminating apparatus and electronic appliance
- Patent Title (中): 形成发光装置布线的方法，用于安装发光装置的基板，显示器，背光，照明装置和电子设备
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Application No.: US11866714Application Date: 2007-10-03
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Publication No.: US07884543B2Publication Date: 2011-02-08
- Inventor: Masato Doi
- Applicant: Masato Doi
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JPP2006-279074 20061012
- Main IPC: H01J1/62
- IPC: H01J1/62 ; H01J63/04 ; H01L33/00
Abstract:
A method of forming a wiring of a light emitting device having an electrode on a light emission surface is disclosed. The method includes: forming the electrode nearly in a linear shape in which the width is narrower than the light emission surface; and forming a wiring that is connected to the electrode nearly in a linear shape in which the width is narrower than the light emission surface to cross the electrode.
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