Invention Grant
US07899570B2 Advanced automatic deposition profile targeting and control by applying advanced polish endpoint system feedback
有权
通过应用先进的抛光端点系统反馈来进行高级自动沉积轮廓目标和控制
- Patent Title: Advanced automatic deposition profile targeting and control by applying advanced polish endpoint system feedback
- Patent Title (中): 通过应用先进的抛光端点系统反馈来进行高级自动沉积轮廓目标和控制
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Application No.: US12038327Application Date: 2008-02-27
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Publication No.: US07899570B2Publication Date: 2011-03-01
- Inventor: Thomas Ortleb , Markus Nopper , Thomas Roessler
- Applicant: Thomas Ortleb , Markus Nopper , Thomas Roessler
- Applicant Address: US TX Austin
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US TX Austin
- Agency: Williams, Morgan & Amerson, P.C.
- Priority: DE102007035833 20070731
- Main IPC: G06F19/00
- IPC: G06F19/00 ; B24B49/12
Abstract:
The present disclosure relates to automatic deposition profile targeting with a combined deposition/polishing apparatus which obtains matching deposition and subsequent polishing profiles by use of feedback data from an advanced polish endpoint system in an advanced process control system.
Public/Granted literature
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