Invention Grant
- Patent Title: Method of fabricating an electronic device
- Patent Title (中): 制造电子装置的方法
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Application No.: US11950280Application Date: 2007-12-04
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Publication No.: US07900349B2Publication Date: 2011-03-08
- Inventor: Seong-Chan Han , Dong-Woo Shin , Young-Soo Lee , Hyo-Jae Bang , Hun Han
- Applicant: Seong-Chan Han , Dong-Woo Shin , Young-Soo Lee , Hyo-Jae Bang , Hun Han
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2006-0121572 20061204
- Main IPC: H05K3/34
- IPC: H05K3/34

Abstract:
An electronic device with a reworkable electronic component, a method of manufacturing the electronic device, and a method of reworking the electronic component are disclosed. The electronic device includes a first cavity provided in a board body. A first metal pattern is provided on the board body and adjacent to the first cavity. A first electronic component is provided in the first cavity. A first connection pattern is provided adjacent to an upper edge portion of the first electronic component and extends to the first metal pattern so that the first metal pattern is electrically connected to the first electronic component.
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