公开(公告)号：US08385080B2

公开(公告)日：2013-02-26

申请号：US13006692

申请日：2011-01-14

Applicant: Jung-Hoon Kim ,  Seong-Chan Han ,  Dong-Chun Lee ,  Jae-Hoon Choi ,  Sun-Kyu Hwang

Inventor： Jung-Hoon Kim ,  Seong-Chan Han ,  Dong-Chun Lee ,  Jae-Hoon Choi ,  Sun-Kyu Hwang

IPC: H05K7/00

CPC classification number: H05K7/00

Abstract: A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board.

Abstract translation: 公开了半导体模块，用于其的插座和半导体模块/插座组件。 半导体模块包括具有多个半导体器件，多个绝缘层和多个金属层的印刷电路板，多个绝缘层和多个金属层交替堆叠。 金属层的露出部分在印刷电路板的第一和第二端处暴露于半导体模块的外部。 第一端和第二端位于印刷电路板的相对端。

公开(公告)号：US08148828B2

公开(公告)日：2012-04-03

申请号：US12604680

申请日：2009-10-23

Applicant: Dong-Woo Shin ,  Seong-Chan Han ,  Sun-Kyu Hwang ,  Hyun-Jong Oh ,  Nam-Yong Oh

Inventor： Dong-Woo Shin ,  Seong-Chan Han ,  Sun-Kyu Hwang ,  Hyun-Jong Oh ,  Nam-Yong Oh

IPC: H01L23/48 ,  H01L23/34

CPC classification number: H01L23/24 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1005 ,  H01L2225/1058 ,  H01L2924/00014 ,  H05K3/284 ,  H05K2201/10515 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1316 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups.

Abstract translation: 提供半导体封装装置。 半导体封装组，侧保持器壁和填充层可以位于基板上。 侧保持器壁可以位于半导体封装组周围。 填充层可以位于侧保持器壁和半导体封装组之间。

公开(公告)号：US07902664B2

公开(公告)日：2011-03-08

申请号：US11878084

申请日：2007-07-20

Applicant: Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Kyung-du Kim ,  Sun-kyu Hwang

Inventor： Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Kyung-du Kim ,  Sun-kyu Hwang

IPC: H01L23/34

CPC classification number: H01L23/13 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0231 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.

Abstract translation: 示例实施例涉及半导体封装。 半导体封装可以包括安装基板，安装到安装基板的半导体芯片，穿过其中并安装到安装基板的至少一个无源部件，以及覆盖安装基板，半导体芯片和至少一个无源部件 。

公开(公告)号：US20100105201A1

公开(公告)日：2010-04-29

申请号：US12650093

申请日：2009-12-30

Applicant: Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

Inventor： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

IPC: H01L21/60

CPC classification number: H05K3/303 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

Abstract translation: 半导体器件包括半导体封装，电路板和间隔保持元件。 半导体封装具有从主体突出的主体和引线。 电路板具有与引线电连接的第一焊盘。 间隔保持构件插入在电路板和主体之间。 间隔保持构件保持引线与第一焊盘之间的间隔。 因此，均匀地保持引线和焊盘之间的间隔，从而提高了半导体器件的热和/或机械可靠性。

公开(公告)号：US20100102427A1

公开(公告)日：2010-04-29

申请号：US12604680

申请日：2009-10-23

Applicant: Dong-Woo Shin ,  Seong-Chan Han ,  Sun-Kyu Hwang ,  Hyun-Jong Oh ,  Nam-Yong Ho

Inventor： Dong-Woo Shin ,  Seong-Chan Han ,  Sun-Kyu Hwang ,  Hyun-Jong Oh ,  Nam-Yong Ho

IPC: H01L25/065 ,  H01L23/52

CPC classification number: H01L23/24 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1005 ,  H01L2225/1058 ,  H01L2924/00014 ,  H05K3/284 ,  H05K2201/10515 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1316 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups.

Abstract translation: 提供半导体封装装置。 半导体封装组，侧保持器壁和填充层可以位于基板上。 侧保持器壁可以位于半导体封装组周围。 填充层可以位于侧保持器壁和半导体封装组之间。

公开(公告)号：US20080136580A1

公开(公告)日：2008-06-12

申请号：US11947422

申请日：2007-11-29

Applicant: Hyo-Jae BANG ,  Dong-Chun LEE ,  Seong-Chan HAN ,  Jung-Hyeon KIM ,  Hyun-Seok CHOI

Inventor： Hyo-Jae BANG ,  Dong-Chun LEE ,  Seong-Chan HAN ,  Jung-Hyeon KIM ,  Hyun-Seok CHOI

IPC: H01C1/01

CPC classification number: H01C1/144 ,  H01C1/01 ,  H01C7/18 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09172 ,  H05K2201/10045 ,  Y02P70/613

Abstract: Provided are a chip network resistor contacting a printed circuit board (PCB) through solder balls and a semiconductor module having the chip network resistor. The chip network resistor includes: a body formed of an insulating material; a resistor formed on the body; external electrodes connected to the resistor and disposed on a lower surface of the body so as to have solder ball pad shapes; and conductive balls adhered on the external electrodes.

Abstract translation: 提供了通过焊球与印刷电路板（PCB）接触的芯片网络电阻器和具有芯片网络电阻器的半导体模块。 芯片网络电阻器包括：由绝缘材料形成的主体; 形成在体上的电阻; 外部电极连接到电阻器并且设置在主体的下表面上以具有焊球形状; 并且导电球附着在外部电极上。

公开(公告)号：US20080079128A1

公开(公告)日：2008-04-03

申请号：US11855951

申请日：2007-09-14

Applicant: Hyo-Jae BANG ,  Seong-Chan HAN ,  Hun HAN ,  Dong-Chun LEE

Inventor： Hyo-Jae BANG ,  Seong-Chan HAN ,  Hun HAN ,  Dong-Chun LEE

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L23/49582 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lead frame type stack package in which a lead of the package is well connected to a semiconductor module, and a method of fabricating the same are provided. A lead of an upper package and a lead of a lower package are connected using laser soldering. Since leads of the upper and lower packages are connected by solder balls without the use of a soldering pot, loss of a plating layer of the lead due to solder dipping is prevented and the leads are well connected without soldering defects when connecting the lead of the lower package to a connection pad of a semiconductor module substrate.

Abstract translation: 一种引线框架型堆叠封装，其中封装的引线与半导体模块良好连接，并提供其制造方法。 使用激光焊接连接上封装的引线和下封装的引线。 由于上，下封装的引线通过焊锡球连接而不使用焊锡锅，因此防止了由焊料浸渍引起的引线的镀层损失，并且当连接引线 下封装到半导体模块基板的连接焊盘。

公开(公告)号：US6062799A

公开(公告)日：2000-05-16

申请号：US103518

申请日：1998-06-23

Applicant: Seong Chan Han ,  Dong Chun Lee ,  Kwang Su Yu ,  O Kyung Kwon

Inventor： Seong Chan Han ,  Dong Chun Lee ,  Kwang Su Yu ,  O Kyung Kwon

IPC: H05K7/14 ,  B65G49/05

CPC classification number: H05K7/1415

Abstract: An apparatus for automatic loading or unloading printed circuit boards (PCBs) for semiconductor modules is disclosed. The apparatus employs an elastic jig carrier into which the PCBs are loaded. The jig carrier includes movable clamps for fixing the PCBs by elastic force. A jig opener of the apparatus applies opening force, in the reverse direction of the elastic force, to the movable clamps so that the PCBs can be loaded into or unloaded from the jig carrier by a picker. The jig carrier is transferred along a conveyor belt, while the PCBs are supplied from a PCB stage such as a tray to the jig carrier. The apparatus may further comprise a gripper and a rotator. The gripper grips the upright PCBs and the rotator rotates them to be horizontal, so that the picker can pick up the horizontal PCBs. The apparatus may also comprise an aligner for exact alignment of the PCBs in the jig carrier. A method for loading or unloading the PCBs into or from the jig carrier is also disclosed in connection with the apparatus.

Abstract translation: 公开了用于半导体模块的用于自动装载或卸载印刷电路板（PCB）的装置。 该装置采用弹性夹具载体，PCB被加载到其中。 夹具载体包括用于通过弹性力固定PCB的可移动夹具。 该装置的夹具开启装置将弹性力的相反方向的打开力施加到可移动夹具上，使得PCB可以通过拾取器装载到夹具或卸载。 夹具托架沿传送带传送，而PCB从PCB台（如托盘）供应到夹具托架。 该装置还可以包括夹持器和旋转器。 夹具夹住直立PCB，旋转器将它们旋转成水平，以便拾取器可以拾取水平PCB。 该装置还可以包括用于准确对准夹具载体中的PCB的对准器。 结合该装置还公开了将PCB加载到夹具载体或从夹具载体卸载的方法。

公开(公告)号：US08587946B2

公开(公告)日：2013-11-19

申请号：US12987552

申请日：2011-01-10

Applicant: Joo-Han Lee ,  Jung-Hoon Kim ,  Seong-Chan Han

Inventor： Joo-Han Lee ,  Jung-Hoon Kim ,  Seong-Chan Han

IPC: H05K7/20

CPC classification number: G06F1/20 ,  G06F1/183 ,  H05K7/1431

Abstract: A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the semiconductor module; and a heat radiating member mounted in the socket main body so as to externally radiate heat that is generated in the semiconductor module and then is delivered from the socket groove and the socket pin. According to the semiconductor module socket apparatus, it is possible to prevent the heat generated in the semiconductor module from being delivered to the main board, to increase the heat radiation efficiency, to significantly save an installation space, to reduce the installation costs, and to realize no-noise and no-vibration of the semiconductor module socket apparatus.

Abstract translation: 一种半导体模块插座装置，包括形成有与半导体模块相对应的插座槽的插座主体; 插座销安装在插座主体的插座槽中，以电连接到半导体模块的模块销; 以及散热构件，其安装在插座主体中，以便外部辐射在半导体模块中产生的热量，然后从插座槽和插座销传送。 根据半导体模块插座装置，可以防止半导体模块中产生的热量被传送到主板，从而提高散热效率，显着地节省安装空间，降低安装成本，并且 实现半导体模块插座装置的无噪声和无振动。

公开(公告)号：US20120207561A1

公开(公告)日：2012-08-16

申请号：US13241339

申请日：2011-09-23

Applicant: Chan-Hyung YUN ,  Hyun-Jong OH ,  Seong-Chan HAN ,  Hun HAN

Inventor： Chan-Hyung YUN ,  Hyun-Jong OH ,  Seong-Chan HAN ,  Hun HAN

IPC: B23Q1/01

CPC classification number: B23Q9/0042 ,  B23C1/08 ,  B23C3/00 ,  H05K3/0052 ,  Y10T409/307728 ,  Y10T409/308568 ,  Y10T409/30924

Abstract: A router apparatus is provided. The router apparatus includes a plurality of panels stacked vertically; a router bit which cuts the panels simultaneously; a first supporting unit connected to one end of the router bit, and a second supporting unit connected to the other end of the router bit. A guide rail is formed in the second supporting unit in order to guide a movement of the router bit.

Abstract translation: 提供路由器设备。 路由器设备包括垂直堆叠的多个面板; 同时切割面板的路由器位; 连接到路由器位的一端的第一支持单元和连接到路由器位的另一端的第二支持单元。 在第二支撑单元中形成导轨，以引导路线钻头的移动。