Invention Grant
- Patent Title: Wafer edge exposure unit
- Patent Title (中): 晶圆边缘曝光单元
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Application No.: US12437776Application Date: 2009-05-08
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Publication No.: US07901854B2Publication Date: 2011-03-08
- Inventor: Po-Chang Huang , Heng-Hsin Liu , Heng-Jen Lee
- Applicant: Po-Chang Huang , Heng-Hsin Liu , Heng-Jen Lee
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Agent Steven E. Koffs
- Main IPC: G03F9/00
- IPC: G03F9/00 ; G03C5/00 ; G03B27/32 ; G03B27/42
Abstract:
A wafer edge exposure unit comprises a chuck for supporting a wafer. The chuck is rotatable about a central axis. A plurality of light sources are positioned or movably positionable with a common radial distance from the axis of the rotatable chuck, each light source configured to direct exposure light on a respective edge portion of the wafer simultaneously.
Public/Granted literature
- US20100285399A1 WAFER EDGE EXPOSURE UNIT Public/Granted day:2010-11-11
Information query
