Enhanced scanner throughput system and method
    2.
    发明授权
    Enhanced scanner throughput system and method 有权
    增强扫描仪吞吐量系统和方法

    公开(公告)号:US08906599B2

    公开(公告)日:2014-12-09

    申请号:US13473695

    申请日:2012-05-17

    CPC classification number: G03F7/70358

    Abstract: A method and system to improve scanner throughput is provided. An image from a reticle is projected onto a substrate using a continuous linear scanning procedure in which an entire column of die or cells of die is scanned continuously, i.e. without stepping to a different location. Each scan includes translating a substrate with respect to a fixed beam. While the substrate is translated, the reticle is also translated. When a first die or cell of die is projected onto the substrate, the reticle translates along a direction opposite the scan direction and as the scan continues along the same direction, the reticle then translates in the opposite direction of the substrate thereby forming an inverted pattern on the next die or cell. The time associated with exposing the substrate is minimized as the stepping operation only occurs after a complete column of cells is scanned.

    Abstract translation: 提供了一种提高扫描仪吞吐量的方法和系统。 使用连续线性扫描程序将来自掩模版的图像投影到基板上,其中连续扫描整列管芯或裸片的单元,即不进入不同的位置。 每个扫描包括相对于固定光束平移衬底。 当底物被翻译时,掩模版也被翻译。 当模具的第一裸片或裸片投影到衬底上时,标线沿着与扫描方向相反的方向平移,并且随着扫描沿着相同的方向继续,标线片然后沿着衬底的相反方向平移,从而形成倒置图案 在下一个死亡或细胞。 与曝光底物相关的时间最小化,因为步进操作仅在扫描完整的单元格列之后才发生。

    SEMICONDUCTOR PROCESSING APPARATUS WITH SIMULTANEOUSLY MOVABLE STAGES
    4.
    发明申请
    SEMICONDUCTOR PROCESSING APPARATUS WITH SIMULTANEOUSLY MOVABLE STAGES 有权
    半导体加工设备与同时可移动的阶段

    公开(公告)号:US20110083496A1

    公开(公告)日:2011-04-14

    申请号:US12576526

    申请日:2009-10-09

    Abstract: A method and apparatus provide for simultaneously moving multiple semiconductor wafers in opposite directions while simultaneously performing processing operations on each of the wafers. The semiconductor wafers are orientated in coplanar fashion and are disposed on stages that simultaneously translate in opposite directions to produce a net system momentum of zero. The die of the respective semiconductor wafers are processed in the same spatial sequence with respect to a global alignment feature of the semiconductor wafer. A balance mass is not needed to counteract the motion of a stage because the opposite motions of the respective stages cancel each other.

    Abstract translation: 一种方法和装置提供同时在相反方向上移动多个半导体晶片,同时对每个晶片执行处理操作。 半导体晶片以共面方式取向,并且设置在同时沿相反方向平移的阶段上,以产生零的系统动量。 相对于半导体晶片的全局对准特征,对相应的半导体晶片的管芯进行相同的空间序列处理。 不需要平衡质量来抵消舞台的运动,因为各个舞台的相反运动彼此抵消。

    Wafer edge exposure unit
    5.
    发明授权
    Wafer edge exposure unit 有权
    晶圆边缘曝光单元

    公开(公告)号:US07901854B2

    公开(公告)日:2011-03-08

    申请号:US12437776

    申请日:2009-05-08

    CPC classification number: G03B27/62 G03F7/70425

    Abstract: A wafer edge exposure unit comprises a chuck for supporting a wafer. The chuck is rotatable about a central axis. A plurality of light sources are positioned or movably positionable with a common radial distance from the axis of the rotatable chuck, each light source configured to direct exposure light on a respective edge portion of the wafer simultaneously.

    Abstract translation: 晶片边缘曝光单元包括用于支撑晶片的卡盘。 卡盘可绕中心轴线旋转。 多个光源以可旋转卡盘的轴线的公共径向距离定位或可移动地定位,每个光源被配置为将曝光光同时引导到晶片的相应边缘部分。

    Line end spacing measurement
    6.
    发明授权
    Line end spacing measurement 有权
    线端距测量

    公开(公告)号:US07393616B2

    公开(公告)日:2008-07-01

    申请号:US11397464

    申请日:2006-04-04

    CPC classification number: G03F7/70616

    Abstract: A method including: providing collinear first and second lines in a mask layer over a substrate, the first line having at one end a first line end and having a first line body adjacent the first line end, and the second line having at one end a second line end and having a second line body adjacent the second line end; measuring line widths of the first line body and the second line body; locating effective line end positions for the first line end based on the line width of the first line body and for the second line end based on the line width of the second line body; and measuring a distance between the effective line end positions, as an effective line end spacing.

    Abstract translation: 一种方法,包括:在衬底上的掩模层中提供共线的第一和第二线,所述第一线在一端具有第一线端并且具有与所述第一线端相邻的第一线体,并且所述第二线在一端具有 第二线端并且具有与第二线端相邻的第二线体; 测量第一线体和第二线体的线宽; 基于第一线体的线宽度和第二线端基于第二线体的线宽来定位第一线端的有效线端位置; 并测量有效线端位置之间的距离,作为有效线端间距。

    In-situ immersion hood cleaning
    7.
    发明授权

    公开(公告)号:US09632426B2

    公开(公告)日:2017-04-25

    申请号:US13008605

    申请日:2011-01-18

    CPC classification number: G03F7/70341 G03F7/70925 H01L21/67057

    Abstract: An apparatus includes a wafer stage configured to secure a wafer; and a cleaning module including a tank adjacent to the wafer stage, and is positioned outside the region occupied by the wafer. The cleaning module is configured to receive de-ionized (DI) water into the tank and extract the DI water out of the tank. The tank is configured to hold DI water with a top surface of the DI water substantially level with a top surface of the wafer.

    System and method for cleaning a wafer chuck
    8.
    发明授权
    System and method for cleaning a wafer chuck 有权
    用于清洁晶片卡盘的系统和方法

    公开(公告)号:US08955530B2

    公开(公告)日:2015-02-17

    申请号:US13008707

    申请日:2011-01-18

    CPC classification number: H01L21/67028

    Abstract: A wafer chuck is cleaned using a cleaning cap to remove processing residue and particulate matter. The cleaning cap is configured to overlie and align with the wafer chuck and includes a base and a first roller connected to the base and having wound therearound a cleaning cloth. The cleaning cap further includes a second roller connected to the base and having attached thereto a free end of the cleaning cloth. During use, the cleaning cloth winds upon the second roller from the first roller when the second roller rotates about its axis. The cleaning cap can be positioned relative the wafer chuck by way of a manipulator to ensure the cleaning cloth contacts the wafer chuck with sufficient force. The cleaning cloth rubs the wafer chuck with both translational motion and rotational motion.

    Abstract translation: 使用清洁盖清洁晶片卡盘以除去加工残留物和颗粒物质。 清洁盖被配置成覆盖并与晶片卡盘对准,并且包括底座和连接到基座并在其周围缠绕清洁布的第一滚子。 清洁帽还包括连接到基座并且附接有清洁布的自由端的第二辊。 在使用期间,当第二辊围绕其轴旋转时,清洁布从第一辊滚动到第二辊上。 清洁盖可以通过操纵器相对于晶片卡盘定位,以确保清洁布以足够的力与晶片卡盘接触。 清洁布用平移运动和旋转运动擦拭晶片卡盘。

    Tool induced shift reduction determination for overlay metrology
    9.
    发明授权
    Tool induced shift reduction determination for overlay metrology 有权
    刀具诱导移位减少确定重叠度量

    公开(公告)号:US08860941B2

    公开(公告)日:2014-10-14

    申请号:US13457832

    申请日:2012-04-27

    CPC classification number: G01B11/00 G03F7/70633

    Abstract: One embodiment relates to a method for semiconductor workpiece processing. In this method, a baseline tool induced shift (TIS) is measured by performing a baseline number of TIS measurements on a first semiconductor workpiece. After the baseline TIS has been determined, the method determines a subsequent TIS based on a subsequent number of TIS measurements taken on a first subsequent semiconductor workpiece. The subsequent number of TIS measurements is less than the baseline number of TIS measurements.

    Abstract translation: 一个实施例涉及一种用于半导体工件加工的方法。 在该方法中,通过在第一半导体工件上执行TIS测量的基线数量来测量基线工具诱发位移(TIS)。 在确定基线TIS之后,该方法基于在第一后续半导体工件上进行的随后的TIS测量数确定随后的TIS。 随后的TIS测量数量小于TIS测量的基线数量。

    Photoresist materials and photolithography processes
    10.
    发明授权
    Photoresist materials and photolithography processes 有权
    光刻胶材料和光刻工艺

    公开(公告)号:US08848163B2

    公开(公告)日:2014-09-30

    申请号:US13050251

    申请日:2011-03-17

    Abstract: A lithography apparatus generates a tunable magnetic field to facilitate processing of photoresist. The lithography apparatus includes a chamber and a substrate stage in the chamber operable to hold a substrate. A magnetic module provides a magnetic field to the substrate on the substrate stage. The magnetic module is configured to provide the magnetic field in a tunable and alternating configuration with respect to its magnitude and frequency. The magnetic field is provided to have a gradient in magnitude along a Z-axis that is perpendicular to the substrate stage to cause magnetically-charged particles disposed over the substrate stage to move up and down along the Z-axis. The lithography apparatus also includes a radiation energy source and an objective lens configured to receive radiation energy from the radiation energy source and direct the radiation energy toward the substrate positioned on the substrate stage.

    Abstract translation: 光刻设备产生可调磁场以便于光致抗蚀剂的加工。 光刻设备包括腔室和腔室中的衬底台,其可操作以保持衬底。 磁性模块为衬底台上的衬底提供磁场。 磁模块被配置为相对于其幅度和频率提供可调和交替配置的磁场。 磁场被提供为具有沿垂直于衬底台的Z轴的幅度梯度,以使得设置在衬底台上的带磁性颗粒沿Z轴上下移动。 光刻设备还包括辐射能量源和物镜,其被配置为从辐射能量源接收辐射能量并将辐射能量引向位于衬底台上的衬底。

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