Invention Grant
- Patent Title: Method of manufacturing hollow micro-needle structures
- Patent Title (中): 中空微针结构的制造方法
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Application No.: US11798884Application Date: 2007-05-17
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Publication No.: US07906273B2Publication Date: 2011-03-15
- Inventor: Chien-Chung Fu
- Applicant: Chien-Chung Fu
- Applicant Address: TW Hsinchu
- Assignee: National Tsing Hua University
- Current Assignee: National Tsing Hua University
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW95118709A 20060526
- Main IPC: G03F7/00
- IPC: G03F7/00

Abstract:
A method of manufacturing a hollow micro-needle structure includes the steps of: disposing a first mask layer and a second mask layer respectively aside a first substrate and aside a rear surface of the first substrate, wherein the first substrate is transparent to predetermined light; forming a photoresist layer on the front surface of the first substrate and the first mask layer; providing the predetermined light to illuminate the first substrate in a direction from the rear surface to the front surface so as to expose the photoresist layer to form an exposed portion and an unexposed portion; and removing the unexposed portion to form the micro-needle structure, which is formed by the exposed portion. The micro-needle structure has an inclined sidewall and a through hole surrounded by the inclined sidewall.
Public/Granted literature
- US20070275521A1 Method of manufacturing hollow micro-needle structures Public/Granted day:2007-11-29
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