Invention Grant
- Patent Title: Mounted body and method for manufacturing the same
- Patent Title (中): 安装体及其制造方法
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Application No.: US11908087Application Date: 2006-02-28
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Publication No.: US07911064B2Publication Date: 2011-03-22
- Inventor: Shingo Komatsu , Seiichi Nakatani , Seiji Karashima , Toshiyuki Kojima , Takashi Kitae , Yoshihisa Yamashita
- Applicant: Shingo Komatsu , Seiichi Nakatani , Seiji Karashima , Toshiyuki Kojima , Takashi Kitae , Yoshihisa Yamashita
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2005-061963 20050307
- International Application: PCT/JP2006/303713 WO 20060228
- International Announcement: WO2006/095602 WO 20060914
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/52 ; H01L23/40 ; H01L23/48 ; H01L21/00
Abstract:
A mounted body of the present invention includes: a multilayer semiconductor chip 20 including a plurality of semiconductor chips 10 (10a, 10b) that are stacked; and a mounting board 13 on which the multilayer semiconductor chip 20 is mounted. In this mounted body, each of the semiconductor chips 10 (10a, 10b) in the multilayer semiconductor chip 20 has a plurality of element electrodes 12 (12a, 12b) on a chip surface 21 (21a, 21b) facing toward the mounting board 13. On the mounting board 13, electrode terminals 14 are formed so as to correspond to the plurality of element electrodes (12a, 12b), respectively, and the electrode terminals 14 of the mounting board and the element electrodes (12a, 12b) are connected electrically to each other via solder bump formed as a result of assembly of solder particles. With this configuration, a mounted body on which a stacked package is mounted can be manufactured easily.
Public/Granted literature
- US20090230546A1 MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2009-09-17
Information query
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