Invention Grant
- Patent Title: Method of manufacturing a layered silicone composite material
- Patent Title (中): 层状有机硅复合材料的制造方法
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Application No.: US10580798Application Date: 2004-11-24
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Publication No.: US07919150B2Publication Date: 2011-04-05
- Inventor: Yoshitsugu Morita , Tomoko Kato , Hiroji Enami
- Applicant: Yoshitsugu Morita , Tomoko Kato , Hiroji Enami
- Applicant Address: JP Tokyo
- Assignee: Dow Corning Toray Company, Ltd.
- Current Assignee: Dow Corning Toray Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Howard & Howard Attorneys PLLC
- Priority: JP2003-400426 20031128
- International Application: PCT/JP2004/017829 WO 20041124
- International Announcement: WO2005/052078 WO 20050609
- Main IPC: B05D5/00
- IPC: B05D5/00 ; B05D1/38 ; B05D3/10
Abstract:
A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.
Public/Granted literature
- US20070134425A1 Method of manufacturing a layered silicone composite material Public/Granted day:2007-06-14
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