Invention Grant
- Patent Title: Apparatus for solder crack deflection
- Patent Title (中): 焊料裂纹偏转装置
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Application No.: US11717902Application Date: 2007-03-13
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Publication No.: US07923125B2Publication Date: 2011-04-12
- Inventor: Chung C. Key , Mustapha Mohd. Faizul , Tan Siew Sang
- Applicant: Chung C. Key , Mustapha Mohd. Faizul , Tan Siew Sang
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
An apparatus that includes a first component defining an interior of the apparatus; a first solder composition exterior to the first component; a second solder composition exterior to the first solder composition and the first component; and a second component exterior to the second solder composition, the first solder composition, and the first component.
Public/Granted literature
- US20070170592A1 Apparatus for solder crack deflection Public/Granted day:2007-07-26
Information query
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