Invention Grant
- Patent Title: Sample dimension inspecting/measuring method and sample dimension inspecting/measuring apparatus
- Patent Title (中): 样品尺寸检测/测量方法和样品尺寸检测/测量仪器
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Application No.: US12279564Application Date: 2007-02-09
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Publication No.: US07923703B2Publication Date: 2011-04-12
- Inventor: Hidetoshi Morokuma , Akiyuki Sugiyama , Ryoichi Matsuoka , Takumichi Sutani , Yasutaka Toyoda
- Applicant: Hidetoshi Morokuma , Akiyuki Sugiyama , Ryoichi Matsuoka , Takumichi Sutani , Yasutaka Toyoda
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-040110 20060217
- International Application: PCT/JP2007/052795 WO 20070209
- International Announcement: WO2007/094439 WO 20070823
- Main IPC: G01N23/00
- IPC: G01N23/00 ; H01J37/28 ; G21K7/00

Abstract:
One of principal objects of the present invention is to provide a sample dimension measuring method for detecting the position of an edge of a two-dimensional pattern constantly with the same accuracy irrespective of the direction of the edge and a sample dimension measuring apparatus. According to this invention, to accomplish the above object, it is proposed to correct the change of a signal waveform of secondary electrons which depends on the direction of scanning of an electron beam relative to the direction of a pattern edge of an inspection objective pattern. It is proposed that when changing the scanning direction of the electron beam in compliance with the direction of a pattern to be measured, errors in the scanning direction and the scanning position are corrected. In this configuration, a sufficient accuracy of edge detection can be obtained irrespective of the scanning direction of the electron beam.
Public/Granted literature
- US20090218491A1 SAMPLE DIMENSION INSPECTING/MEASURING METHOD AND SAMPLE DIMENSION INSPECTING/MEASURING APPARATUS Public/Granted day:2009-09-03
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