Invention Grant
US07927670B2 Silica microspheres, method for making and assembling same and possible uses of silica microspheres
有权
二氧化硅微球，制造和组装方法以及二氧化硅微球的可能用途
- Patent Title: Silica microspheres, method for making and assembling same and possible uses of silica microspheres
- Patent Title (中): 二氧化硅微球，制造和组装方法以及二氧化硅微球的可能用途
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Application No.: US11662656Application Date: 2005-09-19
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Publication No.: US07927670B2Publication Date: 2011-04-19
- Inventor: Sylvain Rakotoarison
- Applicant: Sylvain Rakotoarison
- Agency: Young & Thompson
- Priority: FR0409866 20040917
- International Application: PCT/FR2005/050759 WO 20050919
- International Announcement: WO2006/030166 WO 20060323
- Main IPC: H05H1/24
- IPC: H05H1/24 ; B05D7/00 ; C03B9/00 ; C03B19/00 ; C03C17/00
Abstract:
The invention concerns silica microspheres (M) having an outer diameter between 50 and 125 μm, preferably between 60 and 90 μm, a wall thickness not less than 1 μm, preferably between 1 and 3 μm and a density between 0.3 and 0.7/cm3, a manufacturing method by injecting silica microsphere precursors (MS, PR1, PR1′, PR2′) into an inductive plasma (P), assembly methods and possible uses of silica microspheres.
Public/Granted literature
- US20070231500A1 Silica Microspheres, Method for Making and Assembling Same and Possible Uses of Silica Microspheres Public/Granted day:2007-10-04
Information query
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