Invention Grant
US07932166B2 Field effect transistor having a stressed contact etch stop layer with reduced conformality
有权
场效应晶体管具有减小的保形性的应力接触蚀刻停止层
- Patent Title: Field effect transistor having a stressed contact etch stop layer with reduced conformality
- Patent Title (中): 场效应晶体管具有减小的保形性的应力接触蚀刻停止层
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Application No.: US11693215Application Date: 2007-03-29
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Publication No.: US07932166B2Publication Date: 2011-04-26
- Inventor: Kai Frohberg , Frank Feustel , Thomas Werner
- Applicant: Kai Frohberg , Frank Feustel , Thomas Werner
- Applicant Address: US TX Austin
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US TX Austin
- Agency: Williams, Morgan & Amerson, P.C.
- Priority: DE102006040765 20060831
- Main IPC: H01L21/3205
- IPC: H01L21/3205 ; H01L21/4763

Abstract:
By forming a highly non-conformal stressed overlayer, such as a contact etch stop layer, the efficiency of the stress transfer into the respective channel region of a field effect transistor may be significantly increased. For instance, non-conformal PECVD techniques may be used for forming highly stressed silicon nitride in a non-conformal manner, thereby achieving higher transistor performance for otherwise identical stress conditions.
Public/Granted literature
- US20080054314A1 FIELD EFFECT TRANSISTOR HAVING A STRESSED CONTACT ETCH STOP LAYER WITH REDUCED CONFORMALITY Public/Granted day:2008-03-06
Information query
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