Invention Grant
- Patent Title: Fast wafer inspection system
- Patent Title (中): 快速晶圆检测系统
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Application No.: US12202833Application Date: 2008-09-02
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Publication No.: US07932495B2Publication Date: 2011-04-26
- Inventor: Pavel Adamec
- Applicant: Pavel Adamec
- Applicant Address: DE Heimstetten
- Assignee: ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH
- Current Assignee: ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH
- Current Assignee Address: DE Heimstetten
- Agency: Patterson & Sheridan, L.L.P.
- Main IPC: G21K7/00
- IPC: G21K7/00 ; H01J37/08

Abstract:
A charged particle beam device is provided including a particle source emitting a primary particle beam, a secondary particle beam generated by the impingement of the primary particle beam on the sample, a detection unit for detecting the secondary particle beam, the detector having at least two detector channels, and a distribution deflecting device for deflecting the secondary particle beam in a chronological sequence. Further, a detection assembly for a fast wafer inspection system is provided including a distribution deflecting device for distributing a secondary particle beam in a chronological sequence and a detector for detecting the secondary particle beam, the detector having multiple detector channels. Further, a method of operating a particle beam device with chronological resolution is provided.
Public/Granted literature
- US20100051804A1 FAST WAFER INSPECTION SYSTEM Public/Granted day:2010-03-04
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