Invention Grant
US07932624B2 Semiconductor module, and hybrid vehicle drive device including the same
失效
半导体模块和包括其的混合动力车辆驱动装置
- Patent Title: Semiconductor module, and hybrid vehicle drive device including the same
- Patent Title (中): 半导体模块和包括其的混合动力车辆驱动装置
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Application No.: US12223606Application Date: 2007-02-14
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Publication No.: US07932624B2Publication Date: 2011-04-26
- Inventor: Tadafumi Yoshida
- Applicant: Tadafumi Yoshida
- Applicant Address: JP Toyota-shi
- Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Toyota-shi
- Agency: Kenyon & Kenyon LLP
- Priority: JP2006-041145 20060217
- International Application: PCT/JP2007/053130 WO 20070214
- International Announcement: WO2007/094508 WO 20070823
- Main IPC: B60L1/00
- IPC: B60L1/00 ; H02G3/00 ; B60K6/20 ; B60W20/00

Abstract:
A bus bar constitutes a power line and another bus bar constitutes an earth line. The bus bars are layered in the normal direction of an insulating substrate via an insulating member. Here, the bus bar positioned at the upper side is formed by a metal member and the bus bar positioned at the lower side is formed by a wiring layer formed on the insulating substrate. Since one of the bus bars is the wiring layer fixed to the insulating substrate, it is possible to assure heat radiation of the bus bar. Thus, it is possible to make the bus bar a wiring layer having a comparatively small cross sectional area and reduce the semiconductor module size in the normal direction. By mounting the semiconductor module on the drive device for a hybrid vehicle, it is possible to reduce the vertical-direction size when mounted on the vehicle and lower the position of the center of gravity of the vehicle to improve the running stability.
Public/Granted literature
- US20090015185A1 Semiconductor Module, and Hybrid Vehicle Drive Device Including the Same Public/Granted day:2009-01-15
Information query
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