Invention Grant
- Patent Title: Apparatus and method for thermal processing of substrate
- Patent Title (中): 基板热处理装置及方法
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Application No.: US10940095Application Date: 2004-09-14
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Publication No.: US07935913B2Publication Date: 2011-05-03
- Inventor: Tatsufumi Kusuda
- Applicant: Tatsufumi Kusuda
- Applicant Address: JP
- Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2003-325636 20030918
- Main IPC: H05B1/02
- IPC: H05B1/02 ; G01J5/08 ; G01J5/10

Abstract:
A thermal processing apparatus (1) comprises a chamber body (6), a holding part (7) for holding a substrate (9) inside the chamber body (6), a light emitting part (5) for heating the substrate (9) through light irradiation and a light measuring part (2) for measuring light energy. The light measuring part (2) comprises a calorimeter (24) disposed outside the chamber body (6), a light guide structure (20) for guiding the light inside the chamber body (6) to the calorimeter (24) and a calculation part (25) for performing computations on the basis of an output of the calorimeter (24). In the thermal processing apparatus (1), by measuring the light from the light emitting part (5) by the calorimeter (24), it is possible to measure the energy of light emitted from the light emitting part (5) during thermal processing inside chamber body (6) and obtain a surface temperature of the substrate (9) by the calculation part (25).
Public/Granted literature
- US20050063448A1 Apparatus and method for thermal processing of substrate Public/Granted day:2005-03-24
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