公开(公告)号：US12292334B2

公开(公告)日：2025-05-06

申请号：US16684556

申请日：2019-11-14

Applicant: Maarten Van Laere

Inventor： Maarten Van Laere

IPC: G01J5/08 ,  G01J5/00 ,  G01J5/0875 ,  G01J5/10

Abstract: A thermal infrared sensor with a mount so that it can be fixed onto infrared windows to provide a solution for performing continuous thermal monitoring of equipment that is provisioned with one or more infrared windows. The IR mount can be made out of any material or combination thereof. The mount can be attached in any possible form to the Infrared window or enclosure surrounding the Infrared window. The mount can fully or partially cover the Infrared window to be monitored. Depending on its implementation it could also fully or partially cover more than just one infrared window. The mount can be a mount made specifically for one or more types of Infrared windows or a generic mount. It could be an existing mount that could be used in such a way that when combined with the second element it enables the presented invention.

公开(公告)号：US12235170B2

公开(公告)日：2025-02-25

申请号：US17658564

申请日：2022-04-08

Applicant: Infineon Technologies AG

Inventor： Gerald Stocker ,  Elmar Aschauer ,  Ulf Bartl ,  Thomas Grille ,  Christoph Kovatsch ,  Thomas Krotscheck Ostermann

IPC: G01N33/00 ,  G01J5/02 ,  G01J5/0802 ,  G01J5/0818 ,  G01J5/10 ,  G01K7/01 ,  G01N21/3504

Abstract: A fluid sensor includes a support structure having a top main surface region; a thermal emitter on the top main surface region of the support structure; a thermal radiation detector on the top main surface region of the support structure; and a waveguide structure having a first and a second waveguide section on the top main surface region of the support structure. The first waveguide section guides a first portion of the thermal radiation to the thermal radiation detector and the second waveguide section guides a second portion of the thermal radiation to the thermal radiation detector. The waveguide structure enables an interaction of an evanescence field of the guided first and/or second portion of the thermal radiation with a surrounding fluid.

公开(公告)号：US12228653B2

公开(公告)日：2025-02-18

申请号：US17961649

申请日：2022-10-07

Applicant: Magna Electronics, LLC

Inventor： Bernard de Mersseman ,  Peter Hansson

IPC: G01S7/48 ,  G01J5/10 ,  G01S7/481 ,  G01S17/931 ,  B60T7/12 ,  B60W60/00

Abstract: An example system includes an infrared emitter to output infrared light towards a target, where the infrared light reflects from the target to produce reflected infrared light, and a detector to receive the reflected infrared light and to provide a signal based on the reflected infrared light. The system also includes a lighting system that includes a light emitter to output visible light, a mirror configured (i) to allow the visible light to pass through the mirror and to reflect the reflected infrared light onto the detector, or (ii) to allow the reflected infrared light to pass through the mirror and onto the detector and to reflect the visible light, and one or more optical elements configured to affect the visible light and the reflected infrared light.

公开(公告)号：US20250014161A1

公开(公告)日：2025-01-09

申请号：US18711826

申请日：2022-11-19

Applicant: GEORGIA TECH RESEARCH CORPORATION ,  SYRACUSE UNIVERSITY ,  MASSACHUSETTS INSTITUTE OF TECHNOLOGY

Inventor： Tarek RAKHA ,  Senem VELIPASALAR ,  John FERNANDEZ ,  Norhan BAYOMI

IPC: G06T7/00 ,  G01J5/00 ,  G01J5/10 ,  G05D1/689 ,  G05D105/80 ,  G06T7/33 ,  G06T7/73 ,  G06V10/75 ,  G06V10/764 ,  G06V20/10 ,  G06V20/17 ,  G06V20/64

Abstract: Exemplary methods, systems, apparatus, and computer programs are disclosed for an unmanned aerial system (UAS) inspection system that includes an unmanned aerial system and analysis system for exterior building envelopes and energy performance evaluation and simulation. The UAS can autonomously and systematically collect data for a building's exterior using a payload comprising (i) nondestructive testing (NDT) sensors configured for imaging (visible, infrared, or more) the building and (ii) one or more multi-spectral sensors (LiDAR, ultrasound, radar, or more). The acquired sensor data are provided to an analysis system comprising computer vision (CV) and signal processing modules configured to analyze the acquired data to i) identify building objects (doors, windows, rooftop units, and others) ii) characterize envelope properties (components, heat resistivity, or others) and 3) identify initial thermal anomalies (thermal bridges, physical defects, or infiltration/exfiltration) in a processing pipeline.

公开(公告)号：US12188827B1

公开(公告)日：2025-01-07

申请号：US18081099

申请日：2022-12-14

Applicant: Amazon Technologies, Inc.

Inventor： Eric S. Micko ,  Sonny Windstrup Rasmussen

IPC: G01J5/0806 ,  G01J5/00 ,  G01J5/10 ,  G01V8/10

Abstract: An electronic device includes a first passive infrared (PIR) sensor and a second PIR sensor positive vertically below the first PIR sensor. One or more lenses are shaped and positioned to focus light received at the one or more lenses onto the first PIR sensor and the second PIR sensor. The first PIR sensor has a first field of view (FoV), and the second PIR sensor has a second FoV that is vertically and horizontally offset from the first FoV.

公开(公告)号：US12156673B2

公开(公告)日：2024-12-03

申请号：US17471665

申请日：2021-09-10

Applicant: Covidien LP

Inventor： Aleksandar Marinkovic ,  Dale E. Whipple ,  Jordan A. Whisler

IPC: A61B17/32 ,  A61B1/015 ,  A61B17/42 ,  G01J5/10

Abstract: A surgical instrument includes a handpiece including a housing and a motor disposed in the housing. An end effector assembly is operably coupled to the handpiece. The motor actuates the end effector assembly. A temperature measurement assembly is in the housing. The temperature measurement assembly measures a temperature of the motor. The temperature measurement assembly includes a printed circuit board (PCB) including an orifice extending through the PCB. An infrared (IR) sensor is on the PCB. The IR sensor transmits IR light to a temperature measurement location of the motor through the orifice of the PCB. The IR sensor detects IR light reflected from the temperature measurement location of the motor to determine a temperature of the temperature measurement location of the motor.

公开(公告)号：US12078546B2

公开(公告)日：2024-09-03

申请号：US18324917

申请日：2023-05-26

Applicant: Calumino Pty Ltd.

Inventor： Gabrielle de Wit ,  Marek Steffanson

IPC: G01J5/20 ,  G01J1/04 ,  G01J1/44 ,  G01J5/02 ,  G01J5/40 ,  G02B26/08 ,  G01J5/00 ,  G01J5/10

CPC classification number: G01J5/20 ,  G01J1/0414 ,  G01J1/44 ,  G01J5/0225 ,  G01J5/40 ,  G02B26/0833 ,  G02B26/085 ,  G02B26/0866 ,  G01J2005/0077 ,  G01J2005/106

Abstract: Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.

公开(公告)号：US20240272004A1

公开(公告)日：2024-08-15

申请号：US18108154

申请日：2023-02-10

Applicant: STMicroelectronics International N.V.

Inventor： Enri DUQI ,  Giorgio ALLEGATO

IPC: G01J5/10 ,  B81B7/00 ,  B81C1/00

CPC classification number: G01J5/10 ,  B81B7/0038 ,  B81B7/007 ,  B81C1/00285 ,  B81C1/00301 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/097 ,  B81C2203/0109 ,  B81C2203/0792 ,  G01J2005/106

Abstract: Disclosed herein is a method of forming a thermal sensor, including patterning an active layer on a first face of a handle substrate to form a frame, a mass carrying at least one thermally isolated MOS (TMOS) transistor, and a spring structure connecting the mass to the frame while thermally isolating the mass from the frame. The frame is then bonded to pads on a first face of an integrated circuit substrate. The handle substrate is removed, and a top cap is bonded to the first face of the integrated circuit substrate to enclose at least the mass and spring within the sealed cavity.

公开(公告)号：US20240248282A1

公开(公告)日：2024-07-25

申请号：US18159214

申请日：2023-01-25

Applicant: Applied Materials, Inc.

Inventor： Ala MORADIAN ,  Saurabh CHOPRA ,  Lori D. WASHINGTON

IPC: G02B7/28 ,  G01J5/10 ,  G02B26/02 ,  H01L21/67

CPC classification number: G02B7/28 ,  G01J5/10 ,  G02B26/02 ,  H01L21/67115 ,  G02B26/004

Abstract: Embodiments herein are generally directed to electronic device manufacturing and, more particularly, to systems and methods for lamp heating in thermal processing chambers. In one embodiment, a substrate processing chamber includes a lid, a floor, and a processing volume between the lid and the floor. An upper window is disposed between the lid and the processing volume, a lower window is disposed between the floor and the processing volume. A lamp head is disposed between the lower window and the floor or between the upper window and the lid. At least one lamp is disposed within the lamp head, and a lens is disposed between the lamp head and the processing volume. In another embodiment, a plurality of lamps is disposed within the lamp head including at least one first lamp operating at a first wavelength and at least one second lamp operating at a second wavelength.

公开(公告)号：US20240248041A1

公开(公告)日：2024-07-25

申请号：US18624533

申请日：2024-04-02

Applicant: OUTSENSE DIAGNOSTICS LTD.

Inventor： Ishay Attar ,  Yaara Kapp-Barnea

IPC: G01N21/64 ,  A61B10/00 ,  E03D11/13 ,  G01J3/10 ,  G01J3/28 ,  G01J3/42 ,  G01J5/0806 ,  G01J5/0808 ,  G01J5/10 ,  G01N21/31 ,  G01N33/493 ,  G01N33/574

CPC classification number: G01N21/6486 ,  A61B10/0038 ,  A61B10/007 ,  G01J3/10 ,  G01J3/2803 ,  G01J5/0806 ,  G01J5/0808 ,  G01J5/10 ,  G01N21/31 ,  G01N21/645 ,  G01N33/493 ,  A61B2010/0006 ,  E03D11/13 ,  G01J2003/104 ,  G01J3/42 ,  G01N2021/6421 ,  G01N33/57419

Abstract: Apparatus and methods are described for use with a bodily emission of a subject that is disposed within a toilet bowl. One or more light sensors are configured to receive light from the toilet bowl, while the bodily emission is disposed within the toilet bowl. A computer processor detects a set of three or more spectral components that have a characteristic relationship with each other in a light spectrum of a microorganism, by analyzing the received light, and determines that there is a presence of the microorganism within the bodily emission in response thereto. Other applications are also described.