Invention Grant
US07939133B2 Method of transferring patterned non-densely packed interfacial particle films onto substrates
有权
将图案化非密集填充的界面颗粒膜转移到基底上的方法
- Patent Title: Method of transferring patterned non-densely packed interfacial particle films onto substrates
- Patent Title (中): 将图案化非密集填充的界面颗粒膜转移到基底上的方法
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Application No.: US11895401Application Date: 2007-08-24
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Publication No.: US07939133B2Publication Date: 2011-05-10
- Inventor: Li Jia , Matthew A. Ray
- Applicant: Li Jia , Matthew A. Ray
- Applicant Address: US OH Akron
- Assignee: The University of Akron
- Current Assignee: The University of Akron
- Current Assignee Address: US OH Akron
- Agency: Roetzel & Andress
- Agent Daniel J. Schlue
- Main IPC: B05D1/28
- IPC: B05D1/28 ; B05D3/10
Abstract:
A process for transferring patterned non-densely packed interfacial particle films onto substrates by providing a substrate, modifying the substrate so that it is non-water wetting, providing an interfacial film of charged particles, applying a surface modifying procedure to said particles, and applying the interfacial particle film to the modified substrate to thereby form a patterned non-densely packed film on the substrate.
Public/Granted literature
- US20080053951A1 Method of transferring patterned non-densely packed interfacial particle films onto substrates Public/Granted day:2008-03-06
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