Invention Grant
- Patent Title: Method of controlling statuses of wafers
- Patent Title (中): 控制晶片状态的方法
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Application No.: US11965565Application Date: 2007-12-27
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Publication No.: US07957827B2Publication Date: 2011-06-07
- Inventor: Hui-Shen Shih , Yu-Fang Chien
- Applicant: Hui-Shen Shih , Yu-Fang Chien
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Agent Justin King
- Main IPC: H01L21/00
- IPC: H01L21/00 ; G01B5/02 ; G01B3/22 ; G01B5/20 ; G01D1/00 ; G06F15/00 ; G06F19/00
Abstract:
A method of controlling statuses of a plurality of wafers is described. A status of a wafer among the wafers is determined. An action related to the status is taken, according to the status determined, to the wafer and/or other wafers to improve a yield or yields thereof.
Public/Granted literature
- US20090171495A1 METHOD OF CONTROLLING STATUSES OF WAFERS Public/Granted day:2009-07-02
Information query
IPC分类:
