Invention Grant
- Patent Title: Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them
- Patent Title (中): 金属树脂结构体和树脂封装的半导体器件及其制造方法
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Application No.: US12320559Application Date: 2009-01-29
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Publication No.: US07964975B2Publication Date: 2011-06-21
- Inventor: Ryoichi Kajiwara , Shigehisa Motowaki , Kazutoshi Itou , Hiroshi Hozoji
- Applicant: Ryoichi Kajiwara , Shigehisa Motowaki , Kazutoshi Itou , Hiroshi Hozoji
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2008-020045 20080131
- Main IPC: H01L23/48
- IPC: H01L23/48 ; B05D3/02
Abstract:
A fabrication method for a metal-base/polymer-resin bonded structured body according to the present invention includes the steps of: (1) applying, to a surface of the metal base, a solution containing an organometallic compound decomposable at 350° C. or lower; (2) baking the applied solution in an oxidizing atmosphere to form, on the surface of the metal base, a coating containing an oxide of the metal of the organometallic compound; (3) providing the polymer resin on the coating; and (4) hardening the polymer resin to provide the metal-base/polymer-resin bonded structured body.
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