Invention Grant
US08011563B2 Compliant mold fill head with integrated cavity venting and solder cooling
有权
具有集成腔体排气和焊锡冷却的合适的模具填充头
- Patent Title: Compliant mold fill head with integrated cavity venting and solder cooling
- Patent Title (中): 具有集成腔体排气和焊锡冷却的合适的模具填充头
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Application No.: US11696753Application Date: 2007-04-05
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Publication No.: US08011563B2Publication Date: 2011-09-06
- Inventor: Russell A. Budd , Evan G. Colgan , Peter A. Gruber , Gareth G. Hougham , John P. Karidis
- Applicant: Russell A. Budd , Evan G. Colgan , Peter A. Gruber , Gareth G. Hougham , John P. Karidis
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Priority: JP2006-104267 20060405; JP2006-104268 20060405
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K37/00
Abstract:
A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate.
Public/Granted literature
- US20080245847A1 Compliant Mold Fill Head with Integrated Cavity Venting and Solder Cooling Public/Granted day:2008-10-09
Information query
IPC分类:
