Invention Grant
- Patent Title: Flexible printed circuit board
- Patent Title (中): 柔性印刷电路板
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Application No.: US11905913Application Date: 2007-10-05
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Publication No.: US08014162B2Publication Date: 2011-09-06
- Inventor: Hideki Kusamitsu
- Applicant: Hideki Kusamitsu
- Applicant Address: JP Tokyo
- Assignee: Yamaichi Electronics Co., Ltd.
- Current Assignee: Yamaichi Electronics Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2006-275324 20061006
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/06 ; H05K7/08 ; H05K7/10
Abstract:
A flexible printed circuit board wherein the insulative substrate 34 having a plurality of conductive layers 36b covered with a protective layer 38 is encircled by a mesh-cloth member 32.
Public/Granted literature
- US20080083559A1 Flexible printed circuit board Public/Granted day:2008-04-10
Information query
