Invention Grant
- Patent Title: Electrical fuse structure
- Patent Title (中): 电熔丝结构
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Application No.: US12335510Application Date: 2008-12-15
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Publication No.: US08026573B2Publication Date: 2011-09-27
- Inventor: Chien-Li Kuo , Yung-Chang Lin , Kuei-Sheng Wu , San-Fu Lin
- Applicant: Chien-Li Kuo , Yung-Chang Lin , Kuei-Sheng Wu , San-Fu Lin
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
An electrical fuse structure is disclosed. The electrical fuse structure includes a fuse element disposed on surface of a semiconductor substrate, a cathode electrically connected to one end of the fuse element, and an anode electrically connected to another end of the fuse element. Specifically, a compressive stress layer is disposed on at least a portion of the fuse element.
Public/Granted literature
- US20100148915A1 ELECTRICAL FUSE STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2010-06-17
Information query
IPC分类:
