Invention Grant
US08026618B2 Semiconductor device comprising a plastic housing, a semiconductor chip and an interposer including a convex or concave lens-shape top side fitting shape
有权
半导体装置包括塑料外壳，半导体芯片和包括凸或凹透镜形状的顶侧配件形状的插入件
- Patent Title: Semiconductor device comprising a plastic housing, a semiconductor chip and an interposer including a convex or concave lens-shape top side fitting shape
- Patent Title (中): 半导体装置包括塑料外壳，半导体芯片和包括凸或凹透镜形状的顶侧配件形状的插入件
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Application No.: US11759977Application Date: 2007-06-08
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Publication No.: US08026618B2Publication Date: 2011-09-27
- Inventor: Erich Syri , Gerold Gruendler , Juergen Hoegerl , Thomas Killer , Volker Strutz
- Applicant: Erich Syri , Gerold Gruendler , Juergen Hoegerl , Thomas Killer , Volker Strutz
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Edell, Shapiro & Finnan, LLC
- Priority: DE102004059232 20041208
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
A semiconductor device includes a plastic housing and a semiconductor chip, wherein the semiconductor chip includes an active top side and a rear side. An interposer is arranged on the active top side of the semiconductor chip. At least a portion of the interposer is embedded into the plastic housing, while the top side of the interposer forms the top side of the semiconductor device. A top side fitting shape is arranged on the top side of the interposer, where the top side fitting shape has a predetermined radius of curvature that is free of plastic housing composition, and the top side fitting shape has a convex or concave lens-shaped sphere segment shape.
Public/Granted literature
Information query
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